Finite temperature properties of uranium mononitride

• Published in: Journal of nuclear materials Vol. 576; p. 154241
• Main Authors: Kocevski, Vancho, Rehn, Daniel A., Terricabras, Adrien J., van Veelen, Arjen, Cooper, Michael W.D., Paisner, Scarlett Widgeon, Vogel, Sven C., White, Joshua T., Andersson, David A.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.04.2023
• Subjects: Ab-initio MDN; Crystallographic properties; Elastic properties; Electronic properties; Heat capacity; Neutron diffraction; Phonons; Thermal conductivity; Thermal diffusivity; Electronic properties; Neutron diffraction; Crystallographic properties; Phonons; Heat capacity; UN; Thermal conductivity; Thermal diffusivity; Elastic properties; Ab-initio MDN
• ISSN: 0022-3115; 1873-4820
• DOI: 10.1016/j.jnucmat.2023.154241

Uranium mononitride (UN) is a promising nuclear fuel that combines the advantageous properties of readily used UO2 and uranium alloys, such as high melting temperature and high uranium density, and thermal conductivity, respectively. A better understanding of UN behavior at operating temperatures can be obtained from finite temperature data, such as elastic properties. To get this information, ab initio molecular dynamics (AIMD) simulations were performed at five different temperatures using constant volume (NVT) and constant pressure (NPT) ensembles. Initially, the performance of PBE functional in reproducing experimental crystallographic properties and magnetic ordering is assessed. The finite temperature phonon dispersions are calculated using NVT simulation results, which show a softening of the phonon modes with increasing temperature. The NPT results are used to obtain the thermal expansion of UN and finite temperature electronic properties. The calculated thermal expansion is compared with our measurements using neutron diffraction. Additionally, the temperature dependent elastic properties of UN are evaluated using the strain-stress method in AIMD simulations, indicating that UN becomes softer and more compressible with increasing temperature. Also, the calculated Young’s modulus slope is in very good agreement with the experiment. The finite temperature heat capacity and electronic thermal conductivity are calculated from AIMD simulations, which are in better agreement with the experiment than the heat capacity and thermal conductivity calculated using the structures relaxed at 0 K. Lastly, the thermal diffusivity from AIMD has opposite temperature dependence compared to experimental results, which we argued comes from the underestimated electronic thermal conductivity.