Fabrication of MKIDS for the MicroSpec Spectrometer

Microspec is a new class of submillimeter and millimeter (250-700 μm wavelength) spectrometer, in which the wavelength separation and detection of incident light is done on a single substrate. The instrument is designed for space exploration by offering high spectral resolving power over a broad ban...

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Bibliographic Details
Published inIEEE transactions on applied superconductivity Vol. 23; no. 3; p. 2400404
Main Authors Patel, A., Brown, A., Hsieh, W., Stevenson, T., Moseley, S. H., U-yen, K., Ehsan, N., Barrentine, E., Manos, G., Wollack, E. J.
Format Journal Article Conference Proceeding
LanguageEnglish
Published New York, NY IEEE 01.06.2013
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:Microspec is a new class of submillimeter and millimeter (250-700 μm wavelength) spectrometer, in which the wavelength separation and detection of incident light is done on a single substrate. The instrument is designed for space exploration by offering high spectral resolving power over a broad band, while being orders of magnitude smaller in mass and volume than the present state-of-the-art. The key enabling components for Microspec are background-limited microwave kinetic inductance detectors, which operate over the full bandwidth of the spectrometer. Here we present our fabrication strategy for making these sensitive detectors. A microstrip architecture utilizing a 0.45-μm crystalline silicon dielectric with a molybdenum nitride kinetic inductor material has been adopted. We have optimized wafer-scale lithographic patterning, and have developed processes that allow us to minimize surface roughness that may contribute to detector noise. Additionally, we have optimized the low-temperature wafer bonding process; this process allows us to build superconductors on both sides of the silicon dielectric layer. We present a final fabricated device and resonator operation at cryogenic temperatures.
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content type line 23
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2013.2240152