Increase of adhesion of conductive films on dielectric substrates by means of electric field

Films of aluminium and copper produced by vacuum deposition obtained on the glass substrates were investigated. Improve of the efficiency of adhesion of conductive layers was made by the use of ponderomotive forces of an electric field (electroadhesive effects). It is found that thermal and electric...

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Bibliographic Details
Published inJournal of physics. Conference series Vol. 872; no. 1; pp. 12023 - 12026
Main Authors Pshchelko, N S, Vodkaylo, E G, Klimenkov, B D
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.07.2017
Subjects
Adhesion
Adhesive bonding
Adhesive strength
Aluminum
Dielectric strength
Electric fields
Glass substrates
Physics
Ponderomotive forces
Vacuum deposition
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Summary:Films of aluminium and copper produced by vacuum deposition obtained on the glass substrates were investigated. Improve of the efficiency of adhesion of conductive layers was made by the use of ponderomotive forces of an electric field (electroadhesive effects). It is found that thermal and electric treatment of films make possible to increase the strength of the adhesive bond of the film with the dielectric substrate.
ISSN:1742-6588
1742-6596
DOI:10.1088/1742-6596/872/1/012023