Interfacial morphologies and possible mechanisms of copper wafer bonding

The microstructure morphologies of copper bonded wafers were examined by means of transmission electron microscopy (TEM) and atomic force microscope (AFM). Morphologies of non-distinct, zigzag and distinct interfaces in the bonded layer are observed. A strong relationship between the roughness of su...

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Bibliographic Details
Published inJournal of materials science Vol. 37; no. 16; pp. 3441 - 3446
Main Authors CHEN, K. N, FAN, A, REIF, R
Format Journal Article
LanguageEnglish
Published Heidelberg Springer 15.08.2002
Springer Nature B.V
Subjects
Applied sciences
Atomic force microscopes
Atomic force microscopy
Bonding strength
Copper
Diffusion
Electronics
Exact sciences and technology
Materials
Materials science
Metals. Metallurgy
Microscopes
Morphology
Transmission electron microscopy
Atomic force microscopy
Annealing
Transmission electron microscopy
Morphology
Roughness
Electronics
Copper
Diffusion
Microstructure
Application
Wafer
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Summary:The microstructure morphologies of copper bonded wafers were examined by means of transmission electron microscopy (TEM) and atomic force microscope (AFM). Morphologies of non-distinct, zigzag and distinct interfaces in the bonded layer are observed. A strong relationship between the roughness of surfaces and the individual steps in bonding initiation was found. We propose three different mechanisms to explain the observed morphologies. In addition, the role of atomic diffusion and that of annealing effects during bonding is discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0022-2461
1573-4803
DOI:10.1023/a:1016554821201