The Production of Surface Profiles on Target Components

• Published in: Fusion technology Vol. 35; no. 2; pp. 85 - 89
• Main Authors: Keatch, Robert P., Lawrenson, Brian, Lewis, F. Barrie, Tyrrell, Tony C.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: La Grange Park, IL Taylor & Francis 01.03.1999; American Nuclear Society
• Subjects: Applied sciences; Cross-disciplinary physics: materials science; rheology; Design. Technologies. Operation analysis. Testing; Dry etching; Electronics; Exact sciences and technology; Fabrication; Integrated circuits; Materials science; Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology; Micromachining; Oxidation; Photolithography; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Silicon wafers; Surface treatments; Vapor deposition; Three dimensional structure; Wafers; Laser targets; Micromachining; Silicon; Microelectronics; Experimental study; Surface finishing
• ISSN: 0748-1896
• DOI: 10.13182/FST99-A11963907

This paper describes the processes developed for "micromachining" novel, three-dimensional structures into silicon wafer substrates. The structural detail and dimensions required are similar to those encountered in the manufacture of integrated circuits and consequently, the techniques of oxidation, photolithography, wet, and dry etching, and vacuum deposition all have the potential for use in this area of microfabrication. Although the techniques described are primarily directed towards new processes for the production of miniature free-standing laser targets with varied surface profiles, these techniques are not limited to this, and can also be applied to areas such as microsensors and biomedical technology