Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 42; no. 9; pp. 1415 - 1420
Main Authors Nguyen, H.V., Salm, C., Vroemen, J., Voets, J., Krabbenborg, B., Bisschop, J., Mouthaan, A.J., Kuper, F.G.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.09.2002
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ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(02)00161-0