A mechanical assessment of flexible optoelectronic devices

This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to e...

Full description

Saved in:
Bibliographic Details
Published inThin solid films Vol. 394; no. 1; pp. 201 - 205
Main Authors Chen, Zhong, Cotterell, Brian, Wang, Wei, Guenther, Ewald, Chua, Soo-Jin
Format Journal Article
LanguageEnglish
Published Elsevier B.V 15.08.2001
Subjects
Flexible devices
Indium tin oxide
Interfaces
Optoelectronic devices
Interfaces
Optoelectronic devices
Flexible devices
Indium tin oxide
Online AccessGet full text

Cover

More Information
Summary:This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(01)01138-5