Covalent binding of Pd catalysts to ligating self-assembled monolayer films for selective electroless metal deposition

The selective electroless metallization of surfaces modified by chemisorbed ligand-bearing organo-silane ultrathin films is described. It is reasoned that covalent metal-ligand bond formation could serve as an effective mechanism for anchoring a Pd(II) electroless catalyst to an appropriate surface....

Full description

Saved in:
Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 141; no. 1; pp. 210 - 220
Main Authors DRESSICK, W. J, DULCEY, C. S, GEORGER, J. H, CALABRESE, G. S, CALVERT, J. M
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 1994
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The selective electroless metallization of surfaces modified by chemisorbed ligand-bearing organo-silane ultrathin films is described. It is reasoned that covalent metal-ligand bond formation could serve as an effective mechanism for anchoring a Pd(II) electroless catalyst to an appropriate surface. The process is discussed in terms of development of appropriate Pd(II) catalyst solutions and their interaction with the ligand-modified surfaces. Application of new metallization process to the selective electroless Co and Ni deposition onto silicon and silica substrates photopatterned with organosilicone is presented.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2054686