Special issue on design, test, integration and packaging of MEMS/MOEMS: DTIP, Cannes, 2014

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Bibliographic Details
Published inMicrosystem technologies : sensors, actuators, systems integration Vol. 22; no. 3; p. 449
Main Authors Megherbi, Souhil, Michel, Bernd
Format Journal Article
LanguageEnglish
Published Berlin/Heidelberg Springer Berlin Heidelberg 01.03.2016
Subjects
Editorial
Electronics and Microelectronics
Engineering
Instrumentation
Mechanical Engineering
Nanotechnology
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ISSN:0946-7076
1432-1858
DOI:10.1007/s00542-015-2712-3