Effect of Oxygen Ion Implantation on Physicochemical Structure and Corrosion-Electrochemical Behavior of Copper–Manganese Alloy

• Published in: Inorganic materials : applied research Vol. 12; no. 3; pp. 581 - 587
• Main Authors: Vorobiev, V. L., Bakieva, O. R., Gilmutdinov, F. Z., Kolotov, A. A., Averkiev, I. K., Borisova, E. M., Reshetnikov, S. M.
• Format: Journal Article
• Language: English
• Published: Moscow Pleiades Publishing 01.05.2021; Springer Nature B.V
• Subjects: Anodic polarization; Atomic structure; Buffer solutions; Chemical bonds; Chemical composition; Chemistry; Chemistry and Materials Science; Copper base alloys; Corrosion effects; Effects of Energy Fluxes on Materials; Electrochemical analysis; Electrode polarization; Hydrochloric acid; Industrial Chemistry/Chemical Engineering; Inorganic Chemistry; Ion implantation; Manganese; Materials Science; Oxygen ions; Photoelectrons; Potassium hydroxides; atomic structure; Cu–Mn alloy; oxides; surface; oxygen implantation; electrochemical corrosion; chemical structure
• ISSN: 2075-1133; 2075-115X
• DOI: 10.1134/S2075113321030394

The chemical composition and structure of the Cu–Mn alloy after modification with oxygen ions with an energy of 10–30 keV and a dose of 10 17 cm –2 have been investigated. Changes in the type of chemical bonding and atomic structure in irradiated Cu–Mn samples have been studied by X-ray photoelectron spectroscopy and X-ray diffraction. Electrochemical studies of ion-modified surfaces have been performed by measuring the anodic potentiodynamic polarization curves in a neutral borate buffer solution, hydrochloric acid, and potassium hydroxide.