Electroconducting Polypyrrole Coatings as an Electrode Contact Material on Porous Poly(vinylidene fluoride) Piezofilm

A method for obtaining a wholly polymeric piezoactive material based on porous poly(vinylidene fluoride) films and a conducting polymer polypyrrole is developed. Polypyrrole layers on the surface of porous substrates are formed by in situ oxidative polymerization from a pyrrole solution. It is shown...

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Bibliographic Details
Published inPolymer Science. Series A Vol. 63; no. 1; pp. 45 - 53
Main Authors Elyashevich, G. K., Dmitriev, I. Yu, Rozova, E. Yu
Format Journal Article
LanguageEnglish
Published Moscow Pleiades Publishing 2021
Springer Nature B.V
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Summary:A method for obtaining a wholly polymeric piezoactive material based on porous poly(vinylidene fluoride) films and a conducting polymer polypyrrole is developed. Polypyrrole layers on the surface of porous substrates are formed by in situ oxidative polymerization from a pyrrole solution. It is shown that the relief structure of the surface of porous poly(vinylidene fluoride) films provides a high adhesion of polypyrrole layers to the substrate. It is found that the content of polypyrrole in the composite increases with an increase in the porosity of the substrate. Using electron microscopy, it is demonstrated that the surfaces of the composite samples are coated with a polypyrrole layer and have a globular morphology characteristic of this polymer. It is shown that the highest values of conductivity (σ s = 10 1 S/cm and σ v = 10 –7 S/cm) are achieved when a methanol–water mixture is used as a solvent in pyrrole polymerization. The mechanical characteristics of poly(vinylidene fluoride)–polypyrrole composites remain almost the same as the corresponding values of the initial poly(vinylidene fluoride) substrate. Polypyrrole layers deposited on a porous substrate are used as electrodes for polarizing composites in a constant electric field and for measuring the piezoelectric modulus. The achieved values of the piezoelectric modulus d 31 are about 20 pC/N.
ISSN:0965-545X
1555-6107
DOI:10.1134/S0965545X2101003X