Copper deposition in the presence of polyethylene glycol. I. Quartz crystal microbalance study

The addition of polyethylene glycol (PEG) and Cl exp - to an acid copper electrolyte inhibits the deposition reaction for cathodic overpotentials of up to about 150 mV. Adding Cl exp - only promotes the deposition reaction, while adding PEG alone has a relatively small effect on electrode kinetics....

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Published inJournal of the Electrochemical Society Vol. 145; no. 10; pp. 3472 - 3476
Main Authors KELLY, J. J, WEST, A. C
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 01.10.1998
Subjects
Applied sciences
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
General and physical chemistry
Metallic coatings
Metals. Metallurgy
Production techniques
Study of interfaces
Surface treatment
Copper II Sulfates Hydrates
Rotating disk electrode
Experimental study
Modeling
Acidic solution
Ethylene oxide polymer
Medium effect
Chlorides
Concentration effect
Electrodeposition
Kinetics
Copper
Electrochemical reaction
Quartz microbalance
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Summary:The addition of polyethylene glycol (PEG) and Cl exp - to an acid copper electrolyte inhibits the deposition reaction for cathodic overpotentials of up to about 150 mV. Adding Cl exp - only promotes the deposition reaction, while adding PEG alone has a relatively small effect on electrode kinetics. Frequency shifts of an electrochemical quartz crystal microbalance suggest the adsorption of a monolayer of PEG molecules that are collapsed into spheres provided chloride ions are present, with little adsorption occurring when Cl exp - is absent. This behavior is the same for gold and copper surfaces. Transient current measurements suggest that chloride ions affect the PEG adsorption equilibrium rather than adsorption kinetics alone.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1838829