Integrated Model and Compensation of Thermal Errors of Silicon Microelectromechanical Gyroscope

• Published in: IEEE transactions on instrumentation and measurement Vol. 58; no. 9; pp. 2923 - 2930
• Main Authors: Fang Jiancheng, Fang Jiancheng, Li Jianli, Li Jianli
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.09.2009; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Acceleration; Aerodynamics; Compensation; Dynamics; Error analysis; Error compensation; Errors; Extraterrestrial measurements; gyroscope; Gyroscopes; Mathematical models; microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Permissible error; Sensor phenomena and characterization; Silicon; temperature; Temperature sensors; Thermal sensors
• ISSN: 0018-9456; 1557-9662
• DOI: 10.1109/TIM.2009.2016780

Based on the thermal interferential moment, the dynamic thermal error induced by accelerations of a microelectromechanical system (MEMS) gyroscope is analyzed. The electromechanical-thermal error is discussed. The integrated thermal error compensation method considering the electromechanical-thermal error and the dynamic thermal error induced by accelerations is proposed. The experimental results show that the bias temperature sensitivity is reduced by more than one order of magnitude compared with the raw bias temperature sensitivity of the gyroscope. The integrated compensation method is reasonable and effective in the temperature error compensation of the MEMS gyroscope and outperforms the classical compensation method in performance.