Flexible Organic Light-Emitting Diodes Using a Metal Peel-Off Method

Organic light-emitting diodes were fabricated on a glass-MgO x -Ag layered substrate and separated between Ag and MgO x interface, showing the bending properties. Adhesive force decreased from 18 to 1.4 gf/cm after insertion of the MgO x layer between the Ag and glass. The Ag-O component in Ag 3 d 5...

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Bibliographic Details
Published inIEEE photonics technology letters Vol. 20; no. 22; pp. 1836 - 1838
Main Authors Soo Young Kim, Soo Young Kim, Kisoo Kim, Kisoo Kim, Kihyon Hong, Kihyon Hong, Jong-Lam Lee, Jong-Lam Lee
Format Journal Article
LanguageEnglish
Published New York IEEE 15.11.2008
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Adhesive bonding
Adhesive force
Adhesives
Bending
Bonding
Fabrication
Flat panel displays
flexible devices
Glass
Insertion
Light emitting diodes
Materials science and technology
Metal oxides
Organic light emitting diodes
organic light- emitting diodes (OLEDs)
peel-off
Plastics
Silver
Spectra
Steel
Substrates
work of adhesion
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Summary:Organic light-emitting diodes were fabricated on a glass-MgO x -Ag layered substrate and separated between Ag and MgO x interface, showing the bending properties. Adhesive force decreased from 18 to 1.4 gf/cm after insertion of the MgO x layer between the Ag and glass. The Ag-O component in Ag 3 d 5/2 spectra and O-Ag (ionic bond) component in O 1 s spectra increased as the MgO x layer was thickened. This supports that Ag oxidized to AgO x while the thickness of MgO x increased, resulting in a reduction of the adhesive forces of Ag layer. Therefore, it is concluded that a metal at the interface with a metal oxide is easily oxidized, reducing the adhesive forces and enabling the peel-off process.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2008.2004693