Adhesion of HIPIMS-Deposited Gold to a Polyimide Substrate

Gold is the preferred material for conductive structures in neural implants. The hitherto employed process applies adhesive layers to avoid delamination of gold structures from a polymeric substrate. The possibility to deposit gold without the use of adhesive layers is offered by the high-power impu...

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Bibliographic Details
Published inCoatings (Basel) Vol. 13; no. 2; p. 250
Main Authors Guljakow, Jürgen, Lang, Walter
Format Journal Article
LanguageEnglish
Published Basel MDPI AG 01.02.2023
Subjects
Adhesion
Adhesive strength
Adhesives
Gold
Lang, Lex
Magnetron sputtering
Neural prostheses
Plasma
Polyethylene terephthalate
Polymers
Potassium
Scratch tests
Substrates
Titanium
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Summary:Gold is the preferred material for conductive structures in neural implants. The hitherto employed process applies adhesive layers to avoid delamination of gold structures from a polymeric substrate. The possibility to deposit gold without the use of adhesive layers is offered by the high-power impulse magnetron sputtering (HIPIMS) process. In this work, it is shown that it is possible to utilize the HIPIMS process to deposit gold onto polyimide while having enough adhesion between these two layers to omit the use of an adhesive layer. A scratch test was performed to demonstrate the adherence between the layers.
ISSN:2079-6412
2079-6412
DOI:10.3390/coatings13020250