CMP surface characteristics of twinned copper subgrains

Copper wafers are polished with an experimental slurry prepared to contain strong oxidizing components for revealing grain structures. Two types of surface morphologies, twinned and equiaxed grains, are observed on two groups of wafers, following chemical mechanical planarization (CMP). An atomic fo...

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Bibliographic Details
Published inJournal of physics. D, Applied physics Vol. 37; no. 17; pp. 2446 - 2448
Main Authors Ni, Chaoying, Hall, Ian W, Thomas, Terence M, So, Joseph K, Quanci, John
Format Journal Article
LanguageEnglish
Published IOP Publishing 07.09.2004
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Summary:Copper wafers are polished with an experimental slurry prepared to contain strong oxidizing components for revealing grain structures. Two types of surface morphologies, twinned and equiaxed grains, are observed on two groups of wafers, following chemical mechanical planarization (CMP). An atomic force microscope surface analysis indicates that the equiaxed grain structure provides better overall surface quality than the twinned structure. A polishing model is proposed to explain the surface relief among the twinned subgrains. The results suggest that Cu electroplating and the subsequent annealing processes should be optimized to promote uniform equiaxed grains for better integration with CMP and other chip manufacturing processes.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0022-3727
1361-6463
DOI:10.1088/0022-3727/37/17/017