Evaluation of the microstructure, thermal and mechanical properties of Cu/SiC nanocomposites fabricated by mechanical alloying

• Published in: International journal of minerals, metallurgy and materials Vol. 28; no. 3; pp. 475 - 486
• Main Authors: Moustafa, Essam B., Taha, Mohammed A.
• Format: Journal Article
• Language: English
• Published: Beijing University of Science and Technology Beijing 01.03.2021; Springer Nature B.V; Mechanical Engineering Departments,Faculty of Engineering,King Abdulaziz University,Jeddah 21589,Saudi Arabia%Solid State Physics Department,National Research Centre,El Buhouth St.,Dokki,12622 Giza,Egypt
• Subjects: Argon; Ceramics; Characterization and Evaluation of Materials; Chemistry and Materials Science; Composites; Copper; Corrosion and Coatings; Crystal dislocations; Densification; Dislocation density; Electrical properties; Electrical resistivity; Glass; Materials Science; Mechanical alloying; Mechanical properties; Metallic Materials; Microhardness; Microstrain; Microstructure; Nanocomposites; Natural Materials; Silicon carbide; Sintering; Surfaces and Interfaces; Thermal expansion; Thermal stability; Thermodynamic properties; Thin Films; Tribology; X-ray diffraction; elastic moduli; copper matrix nanocomposites; mechanical alloying; coefficient of thermal expansion; electrical conductivity; silicon carbide; mechan-ical alloying
• ISSN: 1674-4799; 1869-103X
• DOI: 10.1007/s12613-020-2176-z

Nano-sized silicon carbide (SiC: 0wt%, 1wt%, 2wt%, 4wt%, and 8wt%) reinforced copper (Cu) matrix nanocomposites were manufactured, pressed, and sintered at 775 and 875°C in an argon atmosphere. X-ray diffraction (XRD) and scanning electron microscopy were performed to characterize the microstructural evolution. The density, thermal expansion, mechanical, and electrical properties were studied. XRD analyses showed that with increasing SiC content, the microstrain and dislocation density increased, while the crystal size decreased. The coefficient of thermal expansion (CTE) of the nanocomposites was less than that of the Cu matrix. The improvement in the CTE with increasing sintering temperature may be because of densification of the microstructure. Moreover, the mechanical properties of these nanocomposites showed noticeable enhancements with the addition of SiC and sintering temperatures, where the microhardness and apparent strengthening efficiency of nanocomposites containing 8wt% SiC and sintered at 875°C were 958.7 MPa and 1.07 vol% -1 , respectively. The electrical conductivity of the sample slightly decreased with additional SiC and increased with sintering temperature. The prepared Cu/SiC nanocomposites possessed good electrical conductivity, high thermal stability, and excellent mechanical properties.