On Thermal Structure Optimization of a Power LED Lighting

• Published in: Procedia engineering Vol. 29; pp. 2765 - 2769
• Main Author: Bing, Lui Yi
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 2012
• Subjects: heat sink; LED lighting lamp; optimization; heat sink; optimization; LED lighting lamp
• ISSN: 1877-7058; 1877-7058
• DOI: 10.1016/j.proeng.2012.01.387

In this paper, using APDL language to generate the analysis file the LED lamp heat sink of finite element model is established. The length, width and numbers of the heat sink fins being design variables, the maximum junction temperature of LED being the objective function, the mathematical model is set up and optimized using ANSYS thermal analysis software. The results show that the longer the length of heat sink fins, the lower the maximum junction temperature of the chip; the wider the fins width, the higher the maximum chip junction temperature; with the increasing of the numbers of fins, the maximum junction temperature will go down; but when reaching a certain value, the junction temperature will slowly ncrease again. Under the conditions of the LED chip junction temperature not exceeding 60°C, the heat sink structure optimized values were: fin length is 62.5mm, fin width is 1 mm, the number of fins is 20.