Flexible integrated OLED substrates prepared by printing and plating process

We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED de...

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Bibliographic Details
Published inOrganic electronics Vol. 50; pp. 170 - 176
Main Authors Cho, Doo-Hee, Kwon, O Eun, Park, Young-Sam, Yu, Byoung Gon, Lee, Jonghee, Moon, Jaehyun, Cho, Hyunsu, Lee, Hyunkoo, Cho, Nam Sung
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.11.2017
Subjects
Flexible
OLED
Plating
Printing
Substrate
Substrate
Printing
Plating
OLED
Flexible
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Summary:We developed a cost-effective process to fabricate a flexible integrated organic light-emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels. [Display omitted] •A cost-effective process to fabricate flexible integrated OLED substrates is proposed.•A screen printing, a copper plating, and lamination/delamination process are used for the flexible integrated substrate.•Performance of the OLED device with the flexible integrated substrate is comparable to that of a glass substrate.
ISSN:1566-1199
1878-5530
DOI:10.1016/j.orgel.2017.07.041