Reverse recovery characteristics and defect distribution in an electron-irradiated silicon p–n junction diode

Electron irradiation was performed to enhance the switching speed and thereby to reduce the energy loss of a p–n junction diode. The reverse recovery time decreased significantly but other electrical deterioration such as leakage current and on-stage voltage drop due to the electron irradiation was...

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Bibliographic Details
Published inMaterials chemistry and physics Vol. 84; no. 1; pp. 187 - 191
Main Authors Kang, S.M, Eom, T.J, Kim, S.J, Kim, H.W, Cho, J.Y, Lee, Chongmu
Format Journal Article
LanguageEnglish
Published Elsevier B.V 15.03.2004
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Summary:Electron irradiation was performed to enhance the switching speed and thereby to reduce the energy loss of a p–n junction diode. The reverse recovery time decreased significantly but other electrical deterioration such as leakage current and on-stage voltage drop due to the electron irradiation was found not to be much. Also the defect distribution and the type of the electron irradiation-induced defects are discussed based on the deep level transient spectroscopy (DLTS) analysis results and the secondary ion mass spectrometry (SIMS) depth profiles of the silicon substrate.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0254-0584
1879-3312
DOI:10.1016/j.matchemphys.2003.11.030