Analytical treatment of diffusional growth kinetics of two intermetallic-compound layers
Intermetallic compounds are known to form continuous layers at phase interfaces in the course of many technological processes such as hot-dip protective coating of solid surfaces with metals, soldering, welding of dissimilar metals and alloys, sintering in the presence of the liquid phase, making ve...
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Published in | Journal of materials science Vol. 39; no. 21; pp. 6615 - 6617 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
Heidelberg
Springer
01.11.2004
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
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Summary: | Intermetallic compounds are known to form continuous layers at phase interfaces in the course of many technological processes such as hot-dip protective coating of solid surfaces with metals, soldering, welding of dissimilar metals and alloys, sintering in the presence of the liquid phase, making very-large-scale-integrated circuits, etc. The diffusional growth kinetics of intermetallic layers are usually treated using parabolic equations of the type x2 = 2kt, where x is the layer thickness, k is the layer growth-rate constant and t is the time. For sufficiently thick layers, such equations produce quite a satisfactory fit to the experimental data. However, growth kinetics of the ApBq and ArBs layers at the diffusional stage of their formation at the interface between simple substances A and B dare somewhat more complicated and described by a system of two non-linear equations. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0022-2461 1573-4803 |
DOI: | 10.1023/B:JMSC.0000044905.89450.f5 |