Analytical treatment of diffusional growth kinetics of two intermetallic-compound layers

Intermetallic compounds are known to form continuous layers at phase interfaces in the course of many technological processes such as hot-dip protective coating of solid surfaces with metals, soldering, welding of dissimilar metals and alloys, sintering in the presence of the liquid phase, making ve...

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Bibliographic Details
Published inJournal of materials science Vol. 39; no. 21; pp. 6615 - 6617
Main Authors DYBKOV, O. V, DYBKOV, V. I
Format Journal Article
LanguageEnglish
Published Heidelberg Springer 01.11.2004
Springer Nature B.V
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Summary:Intermetallic compounds are known to form continuous layers at phase interfaces in the course of many technological processes such as hot-dip protective coating of solid surfaces with metals, soldering, welding of dissimilar metals and alloys, sintering in the presence of the liquid phase, making very-large-scale-integrated circuits, etc. The diffusional growth kinetics of intermetallic layers are usually treated using parabolic equations of the type x2 = 2kt, where x is the layer thickness, k is the layer growth-rate constant and t is the time. For sufficiently thick layers, such equations produce quite a satisfactory fit to the experimental data. However, growth kinetics of the ApBq and ArBs layers at the diffusional stage of their formation at the interface between simple substances A and B dare somewhat more complicated and described by a system of two non-linear equations.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0022-2461
1573-4803
DOI:10.1023/B:JMSC.0000044905.89450.f5