A susceptor with a ∧-shaped slot in a vertical MOCVD reactor by induction heating

By using the numerical simulation for the temperature field in the metal organic vapor deposition （MOCVD） reactor by induction heating, it is found that the temperature distribution in the conventional cylinder-shaped susceptor is nonuniform due to the skin effect of the induced current, which makes...

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Published inJournal of semiconductors Vol. 35; no. 9; pp. 11 - 15
Main Author 李志明 李海玲 甘小冰 江海鹰 李金屏 付小倩 韩延彬 夏英杰 尹建芹 黄艺美 胡仕刚
Format Journal Article
LanguageEnglish
Published 01.09.2014
Subjects
MOCVD
不均匀
反应器
垂直
感应加热
接受器
气相沉积
温度分布
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ISSN1674-4926
DOI10.1088/1674-4926/35/9/092003

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Summary:By using the numerical simulation for the temperature field in the metal organic vapor deposition （MOCVD） reactor by induction heating, it is found that the temperature distribution in the conventional cylinder-shaped susceptor is nonuniform due to the skin effect of the induced current, which makes the temperature distribution of the wafer nonuniform. Therefore, a novel susceptor with a A-shaped slot is proposed. This slot changes the mode and the rate of the heat transfer in the susceptor, which improves the uniformity of the temperature distribution in the wafer. By using the finite element method （FEM）, the susceptor with this structure for heating a wafer of four inches in diameter is optimized. It is observed that the optimized susceptor with the A-shaped slot makes the uniformity of the temperature distribution in the wafer improve by more than 85%, and a good uniformity of temperature distributions is kept under different wafer temperatures, which may be beneficial to the film growth.
Bibliography:Li Zhiming, Li Hailing, Gan Xiaobing, Jiang Haiying, Li Jinping, Fu Xiaoqian, Han Yanbin, Xia Yingjie, Yin Jianqin, Huang Yimei, and Hu Shigang4 （1.Shandong Provincial Key Laboratory of Network Based Intelligent Computing, School of Information Science and Engineering, University of Jinan, Ji＇nan 250022, China; 2.Shandong College of Electronic Technology, Ji＇nan 250022, China ;3.College of Management, Shenzhen University, Shenzhen 518060, China ;4.School of Information and Electrical Engineering, Hunan University of Science and Technology, Xiangtan 411201, China）
induction heat; MOCVD; finite element analysis; temperature field
11-5781/TN
By using the numerical simulation for the temperature field in the metal organic vapor deposition （MOCVD） reactor by induction heating, it is found that the temperature distribution in the conventional cylinder-shaped susceptor is nonuniform due to the skin effect of the induced current, which makes the temperature distribution of the wafer nonuniform. Therefore, a novel susceptor with a A-shaped slot is proposed. This slot changes the mode and the rate of the heat transfer in the susceptor, which improves the uniformity of the temperature distribution in the wafer. By using the finite element method （FEM）, the susceptor with this structure for heating a wafer of four inches in diameter is optimized. It is observed that the optimized susceptor with the A-shaped slot makes the uniformity of the temperature distribution in the wafer improve by more than 85%, and a good uniformity of temperature distributions is kept under different wafer temperatures, which may be beneficial to the film growth.
ISSN:1674-4926
DOI:10.1088/1674-4926/35/9/092003