Microstructural stability of nanostructured Cu alloys during high-temperature irradiation

The stability of model nanostructured Cu 90Mo 10 and Cu 90W 10 alloys during irradiation with 1.8 MeV Kr + at very high temperatures was investigated. Significant coarsening occurs only above ∼0.6 T m in Cu 90Mo 10 and ∼0.8 T m in Cu 90W 10 ( T m is the melting point of Cu). Below these temperatures...

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Bibliographic Details
Published inScripta materialia Vol. 63; no. 9; pp. 929 - 932
Main Authors Vo, Nhon Q., Chee, See W., Schwen, Daniel, Zhang, Xuan, Bellon, Pascal, Averback, Robert S.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.11.2010
Subjects
Alloys
COMPOSITES
Copper
COPPER ALLOYS (40 TO 99.3 CU)
Cu alloys
Grain size
GRAIN SIZE AND SHAPE
Implantation
IRRADIATION
MELTING POINT
Microstructure
MICROSTRUCTURES
Nanocomposites
Nanomaterials
Nanostructure
Nanostructures
RADIATION
Stability
Thin films
Thin films
Implantation
Cu alloys
Nanostructures
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Summary:The stability of model nanostructured Cu 90Mo 10 and Cu 90W 10 alloys during irradiation with 1.8 MeV Kr + at very high temperatures was investigated. Significant coarsening occurs only above ∼0.6 T m in Cu 90Mo 10 and ∼0.8 T m in Cu 90W 10 ( T m is the melting point of Cu). Below these temperatures, nanoprecipitates nucleate and grow to a saturation diameter of ∼4 nm. These very small nanoprecipitates confer remarkable microstructural stability, with the Cu grain size remaining below 40 nm. Computer simulations help to explain why these nanostructures are so stable.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2010.07.009