Robustness evaluation using highly accelerated life testing

This paper presents experimental aspects and results of highly accelerated life testing in order to study the robustness of electronic boards subject to two main covariates: thermal and vibration stresses. Statistical analysis of test results and assessment of the product quality characteristics und...

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Bibliographic Details
Published inInternational journal of advanced manufacturing technology Vol. 56; no. 9-12; pp. 1253 - 1261
Main Authors Charki, Abdérafi, Laronde, R., Guérin, F., Bigaud, D., Coadou, F.
Format Journal Article
LanguageEnglish
Published London Springer-Verlag 01.10.2011
Springer Nature B.V
Springer Verlag
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ISSN0268-3768
1433-3015
DOI10.1007/s00170-011-3264-z

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Summary:This paper presents experimental aspects and results of highly accelerated life testing in order to study the robustness of electronic boards subject to two main covariates: thermal and vibration stresses. Statistical analysis of test results and assessment of the product quality characteristics under different conditions (operating and destruction limits) are presented. Recommendations for further testing are also presented.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-011-3264-z