A conduction model for semiconductor-grain-boundary-semiconductor barriers in polycrystalline-silicon films
A quantitative trapping model is introduced to describe the electrical properties of a semiconductor-grain-boundary-semiconductor (SGBS) barrier in polysilicon films over a wide temperature range. The grain-boundary scattering effects on carrier transport are studied analytically by examining the be...
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Published in | IEEE transactions on electron devices Vol. 30; no. 2; pp. 137 - 149 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.02.1983
Institute of Electrical and Electronics Engineers |
Subjects | |
Online Access | Get full text |
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Summary: | A quantitative trapping model is introduced to describe the electrical properties of a semiconductor-grain-boundary-semiconductor (SGBS) barrier in polysilicon films over a wide temperature range. The grain-boundary scattering effects on carrier transport are studied analytically by examining the behavior of the height and width of a rectangular grain-boundary potential barrier. The model also verifies the applicability of a single-crystal band diagram for the crystallite within which an impurity level exists. Carder transport includes not only thermionic field emission through the space-charge potential barrier resulting from trapping effects and through the grain-boundary scattering potential barrier but also thermionic emission over these barriers. Thermionic emission dominates at high temperatures; however, at low temperatures, thermionic field emission becomes more important and the grain-boundary scattering effects are an essential factor. By characterizing the experimental data of the I-V characteristics, resistivity, mobility, and carrier concentration, this model enhances the understanding of the current transport in polysilicon films with grain sizes from 100 Å to 1 µm, doping levels from 1 × 10 16 to 8 × 10 19 cm -3 , and measurement temperatures from -176 to 144°C. The limitations of the model are also discussed. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/T-ED.1983.21087 |