A conduction model for semiconductor-grain-boundary-semiconductor barriers in polycrystalline-silicon films

A quantitative trapping model is introduced to describe the electrical properties of a semiconductor-grain-boundary-semiconductor (SGBS) barrier in polysilicon films over a wide temperature range. The grain-boundary scattering effects on carrier transport are studied analytically by examining the be...

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Bibliographic Details
Published inIEEE transactions on electron devices Vol. 30; no. 2; pp. 137 - 149
Main Authors Lu, N.C.-C., Gerzberg, L., Chih-Yuan Lu, Meindl, J.D.
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.02.1983
Institute of Electrical and Electronics Engineers
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Summary:A quantitative trapping model is introduced to describe the electrical properties of a semiconductor-grain-boundary-semiconductor (SGBS) barrier in polysilicon films over a wide temperature range. The grain-boundary scattering effects on carrier transport are studied analytically by examining the behavior of the height and width of a rectangular grain-boundary potential barrier. The model also verifies the applicability of a single-crystal band diagram for the crystallite within which an impurity level exists. Carder transport includes not only thermionic field emission through the space-charge potential barrier resulting from trapping effects and through the grain-boundary scattering potential barrier but also thermionic emission over these barriers. Thermionic emission dominates at high temperatures; however, at low temperatures, thermionic field emission becomes more important and the grain-boundary scattering effects are an essential factor. By characterizing the experimental data of the I-V characteristics, resistivity, mobility, and carrier concentration, this model enhances the understanding of the current transport in polysilicon films with grain sizes from 100 Å to 1 µm, doping levels from 1 × 10 16 to 8 × 10 19 cm -3 , and measurement temperatures from -176 to 144°C. The limitations of the model are also discussed.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9383
1557-9646
DOI:10.1109/T-ED.1983.21087