Dendrimers with Thermally Labile End Groups: An Alternative Approach to Chemically Amplified Resist Materials Designed for Sub-100 nm Lithography

Chemically amplified resists based on dendritic polymer resins are investigated by these authors. The synthesis of the dendrimers, which are based on the polyfunctional core shown in the Figure, is described and properties such as Tdecomp and Tg are examined. Resist formulations prepared from these...

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Bibliographic Details
Published inAdvanced materials (Weinheim) Vol. 12; no. 15; pp. 1118 - 1122
Main Authors Tully, D. C., Trimble, A. R., Fréchet, J. M. J.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag GmbH 01.08.2000
WILEY‐VCH Verlag GmbH
Subjects
chemically amplified
Dendrimers
Lithography
Resists
Resists, chemically amplified
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Summary:Chemically amplified resists based on dendritic polymer resins are investigated by these authors. The synthesis of the dendrimers, which are based on the polyfunctional core shown in the Figure, is described and properties such as Tdecomp and Tg are examined. Resist formulations prepared from these dendrimers are shown to be highly sensitive to both deep UV and e‐beam exposure, allowing reproducible patterning well below 100 nm.
Bibliography:istex:FCA991EFBA20EC3EC645B4F0137FC60BFE3D3835
ArticleID:ADMA1118
ark:/67375/WNG-T3ZZ6XQ0-X
ISSN:0935-9648
1521-4095
DOI:10.1002/1521-4095(200008)12:15<1118::AID-ADMA1118>3.0.CO;2-I