Rapid thermal process for enhancement of collimated titanium nitride barriers

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 144; no. 2; pp. 664 - 669
Main Authors KIM, S.-D, JIN, S.-G, HONG, M.-R, KIM, C.-T
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 01.02.1997
Subjects
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Diffusion barrier
Rapid thermal annealing
Titanium Nitrides
Binary compound
Microelectronic fabrication
Experimental study
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1837464