A preliminary experimental validation of superposition strategy in thermal management of integrated circuit with multiple hot-spots

Thermal management is a key issue in the integrated circuit （IC） design. In this paper, the superposition strategy was experimentally validated using a modeling IC device, which was fabricated by laboratory-level microfabrication technique. Metal thin film resistors on the top of dielectric layer we...

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Bibliographic Details
Published inScience China. Technological sciences Vol. 57; no. 11; pp. 2138 - 2143
Main Authors Liu, Kun, Pi, YuDan, Wang, Wei, Li, ZhiHong, Chen, Jing, Jin, YuFeng
Format Journal Article
LanguageEnglish
Published Heidelberg Science China Press 01.11.2014
Subjects
Devices
Engineering
IC器件
Integrated circuits
Mathematical models
Modelling
Optimization
Resistors
Strategy
Thermal management
叠加计算
实验室
微细加工技术
热管理
薄膜电阻
集成电路器件
验证
multiple hot-spots
superposition strategy
thermal management
influence coefficient
modeling IC device
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Summary:Thermal management is a key issue in the integrated circuit （IC） design. In this paper, the superposition strategy was experimentally validated using a modeling IC device, which was fabricated by laboratory-level microfabrication technique. Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device. The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations. With the help of the superposition strategy, thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually. The influence coefficients in the superposition strategy ex- tracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.
Bibliography:Thermal management is a key issue in the integrated circuit （IC） design. In this paper, the superposition strategy was experimentally validated using a modeling IC device, which was fabricated by laboratory-level microfabrication technique. Metal thin film resistors on the top of dielectric layer were used to analogize the multiple hot-spots in the modeling IC device. The measured temperature rise with multiple hot-spots agrees well with the predictions given by the superposition calculations. With the help of the superposition strategy, thermal management of IC device can be significantly simplified by decomposing the system into sub-systems and optimizing each part individually. The influence coefficients in the superposition strategy ex- tracted from the experimental measurement offer the IC designers a useful engineering tool to facility the thermal optimization and evaluate the thermal performance of IC devices.
superposition strategy, thermal management, modeling IC device, multiple hot-spots, influence coefficient
11-5845/TH
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1674-7321
1869-1900
DOI:10.1007/s11431-014-5645-7