The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder

During soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated solder melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate th...

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Bibliographic Details
Published inJOM (1989) Vol. 61; no. 1; pp. 76 - 79
Main Author Dybkov, V. I.
Format Journal Article
LanguageEnglish
Published Boston Springer US 2009
Springer Nature B.V
Subjects
Alloys
Chemical reactions
Chemistry/Food Science
Cobalt
Earth Sciences
Engineering
Environment
Interfaces
Intermetallic compounds
Kinetics
Metals
Phase Transformations
Physics
Soldering
Studies
Liquid Solder
Intermetallic Layer
Solid Metal
Layer Growth Rate
CoSn
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Summary:During soldering, intermetallic layers can occur at the interface of a solid metal and the saturated or undersaturated solder melt. In systems with a considerable solubility in the liquid state, dissolution causes a manifold drop in layer thickness. Mathematical equations are proposed to evaluate the thickness of any intermetallic layer formed under conditions of simultaneous dissolution in the undersaturated solder melt. The main features of reactive phase formation at the solid metalliquid solder interface are illustrated using the Co-Sn couple with the growing CoSn 3 (250°C) and CoSn 2 (350°C and 450°C) layers as examples.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-009-0015-9