Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock
Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic...
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Published in | Journal of materials research Vol. 20; no. 2; pp. 364 - 374 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York, USA
Cambridge University Press
01.02.2005
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Subjects | |
Online Access | Get full text |
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Summary: | Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn–Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions. |
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Bibliography: | PII:S0884291400084120 ArticleID:08412 ark:/67375/6GQ-R955V06Z-J istex:ACAE8F27DC79AC7E8007AB0C7B225D73B102F0A6 ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0884-2914 2044-5326 |
DOI: | 10.1557/JMR.2005.0064 |