Development of TiB2 Dispersed Aluminum Composites by Spark Plasma Sintering
In order to obtain the high performance materials with high thermal conductivity, high electrical conductivity, low thermal expansion, good mechanical properties and low density, TiB2 particle dispersed aluminum (Al) composites was developed by spark plasma sintering. As these properties are affecte...
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Published in | Materials science forum Vol. 877; pp. 601 - 605 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Trans Tech Publications Ltd
01.11.2016
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Subjects | |
Online Access | Get full text |
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Summary: | In order to obtain the high performance materials with high thermal conductivity, high electrical conductivity, low thermal expansion, good mechanical properties and low density, TiB2 particle dispersed aluminum (Al) composites was developed by spark plasma sintering. As these properties are affected by the dispersibility of the particles, the relationship among the dispersibility of dispersant and the thermal conductivity and mechanical properties was investigated, 20 vol. % TiB2 dispersed Al composites with different dispersibility were fabricated by spark plasma sintering (SPS). The dispersibility was estimated quantitatively by using the definition method of local number of particles (LN2DR method), and two composites having 6.884 and 4.839 for number of LN2DR was obtained. Thermal conductivity of the composites with homogeneous distribution of TiB2 particles was lower than that with heterogeneous distribution and clustering. On the other hand, the tensile strength of the composites improved as increasing temperature compared with Al block. Furthermore, strength of the composites with homogeneous distribution of TiB2 particles at 200°C and more was higher than that of the composites with heterogeneous distribution and clustering. |
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Bibliography: | Selected, peer reviewed papers from the 15th International Conference on Aluminium Alloys (ICAA15), June 12-16, 2016, Chongqing, China |
ISSN: | 0255-5476 1662-9752 1662-9752 |
DOI: | 10.4028/www.scientific.net/MSF.877.601 |