Compound buried layer SOI high voltage device with a step buried oxide
A silicon-on-insulator (SOI) high performance lateral double-diffusion metal oxide semiconductor (LDMOS) on a compound buried layer (CBL) with a step buried oxide (SBO CBL SOI) is proposed. The step buried oxide locates holes in the top interface of the upper buried oxide (UBO) layer. Furthermore, h...
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Published in | Chinese physics B Vol. 20; no. 7; pp. 399 - 404 |
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Main Author | |
Format | Journal Article |
Language | English |
Published |
01.07.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A silicon-on-insulator (SOI) high performance lateral double-diffusion metal oxide semiconductor (LDMOS) on a compound buried layer (CBL) with a step buried oxide (SBO CBL SOI) is proposed. The step buried oxide locates holes in the top interface of the upper buried oxide (UBO) layer. Furthermore, holes with high density are collected in the interface between the polysilicon layer and the lower buried oxide (LBO) layer. Consequently, the electric fields in both the thin LBO and the thick UBO are enhanced by these holes, leading to an improved breakdown voltage. The breakdown voltage of the SBO CBL SOI LDMOS increases to 847 V from the 477 V of a conventional SOI with the same thicknesses of SOI layer and the buried oxide layer. Moreover, SBO CBL SOI can also reduce the self-heating effect. |
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Bibliography: | Wang Yuan-Gang, Luo Xiao-Rong, Ge Rui, Wu Li-Juan, Chen Xi, Yao Guo-Liang, Lei Tian-Fei, Wang Qi, Fan Jie , Hu Xia-Rong State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China A silicon-on-insulator (SOI) high performance lateral double-diffusion metal oxide semiconductor (LDMOS) on a compound buried layer (CBL) with a step buried oxide (SBO CBL SOI) is proposed. The step buried oxide locates holes in the top interface of the upper buried oxide (UBO) layer. Furthermore, holes with high density are collected in the interface between the polysilicon layer and the lower buried oxide (LBO) layer. Consequently, the electric fields in both the thin LBO and the thick UBO are enhanced by these holes, leading to an improved breakdown voltage. The breakdown voltage of the SBO CBL SOI LDMOS increases to 847 V from the 477 V of a conventional SOI with the same thicknesses of SOI layer and the buried oxide layer. Moreover, SBO CBL SOI can also reduce the self-heating effect. breakdown voltage, step buried oxide, compound buried layer, self-heating effect 11-5639/O4 ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 ObjectType-Article-1 ObjectType-Feature-2 |
ISSN: | 1674-1056 2058-3834 |
DOI: | 10.1088/1674-1056/20/7/077304 |