Light emitting diodes reliability review

• Published in: Microelectronics and reliability Vol. 52; no. 5; pp. 762 - 782
• Main Authors: Chang, Moon-Hwan, Das, Diganta, Varde, P.V., Pecht, Michael
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.05.2012
• Subjects: Construction industry; Failure; Failure mechanisms; Light-emitting diodes; Medical services; Microelectronics; Packages; Semiconductors
• ISSN: 0026-2714; 1872-941X
• DOI: 10.1016/j.microrel.2011.07.063

► This paper provides a comprehensive review of LED failure mechanisms and reliability. ► We discuss the fundamental types of LED failure mechanisms from a physics-of-failure perspective. ► For each mechanism, the failure causes and the failure modes are discussed. ► Suggestions for future research are also provided. The increasing demand for light emitting diodes (LEDs) has been driven by a number of application categories, including display backlighting, communications, medical services, signage, and general illumination. The construction of LEDs is somewhat similar to microelectronics, but there are functional requirements, materials, and interfaces in LEDs that make their failure modes and mechanisms unique. This paper presents a comprehensive review for industry and academic research on LED failure mechanisms and reliability to help LED developers and end-product manufacturers focus resources in an effective manner. The focus is on the reliability of LEDs at the die and package levels. The reliability information provided by the LED manufacturers is not at a mature enough stage to be useful to most consumers and end-product manufacturers. This paper provides the groundwork for an understanding of the reliability issues of LEDs across the supply chain. We provide an introduction to LEDs and present the key industries that use LEDs and LED applications. The construction details and fabrication steps of LEDs as they relate to failure mechanisms and reliability are discussed next. We then categorize LED failures into thirteen different groups related to semiconductor, interconnect, and package reliability issues. We then identify the relationships between failure causes and their associated mechanisms, issues in thermal standardization, and critical areas of investigation and development in LED technology and reliability.