Power distribution over the wafer-scale monolithic pixel detector — MOSAIX for ALICE ITS3
For the LS3 ALICE ITS3 upgrade the detector material budget reduction has been pushed to the limit by proposing a system composed almost exclusively of silicon wafer thinned down to 50μm. This improves performance, but adds complexity to the ASIC design. It requires a wafer-scale module with embedde...
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Published in | Journal of instrumentation Vol. 20; no. 2; p. C02015 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Bristol
IOP Publishing
01.02.2025
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Subjects | |
Online Access | Get full text |
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Summary: | For the LS3 ALICE ITS3 upgrade the detector material budget reduction has been pushed to the limit by proposing a system composed almost exclusively of silicon wafer thinned down to 50μm. This improves performance, but adds complexity to the ASIC design. It requires a wafer-scale module with embedded power delivery network and on-chip data transfer, which were usually done through flexible printed circuit cable.This contribution covers different aspects of the power delivery network design for a wafer-scale detector. It describes the difficulties, shows possible solutions and presents the power scheme design of the full-size ITS3 sensor prototype MOSAIX. |
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Bibliography: | JINST_046P_1124 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
ISSN: | 1748-0221 |
DOI: | 10.1088/1748-0221/20/02/C02015 |