Power distribution over the wafer-scale monolithic pixel detector — MOSAIX for ALICE ITS3

For the LS3 ALICE ITS3 upgrade the detector material budget reduction has been pushed to the limit by proposing a system composed almost exclusively of silicon wafer thinned down to 50μm. This improves performance, but adds complexity to the ASIC design. It requires a wafer-scale module with embedde...

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Bibliographic Details
Published inJournal of instrumentation Vol. 20; no. 2; p. C02015
Main Authors Aglieri Rinella, G., Bugiel, S., Dobrijevic, D., Lemoine, C., Snoeys, W., Vicente Leitao, P.
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.02.2025
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Summary:For the LS3 ALICE ITS3 upgrade the detector material budget reduction has been pushed to the limit by proposing a system composed almost exclusively of silicon wafer thinned down to 50μm. This improves performance, but adds complexity to the ASIC design. It requires a wafer-scale module with embedded power delivery network and on-chip data transfer, which were usually done through flexible printed circuit cable.This contribution covers different aspects of the power delivery network design for a wafer-scale detector. It describes the difficulties, shows possible solutions and presents the power scheme design of the full-size ITS3 sensor prototype MOSAIX.
Bibliography:JINST_046P_1124
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ISSN:1748-0221
DOI:10.1088/1748-0221/20/02/C02015