Early stage dynamic damage and the role of grain boundary type

The role of grain boundary type in the early stages of dynamic damage evolution in copper has been investigated. Through a combination of polycrystalline and large-grained specimens, it has been shown that Σ3 and low-angle boundaries are resistant to void nucleation during shock loading to peak comp...

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Bibliographic Details
Published inScripta materialia Vol. 66; no. 9; pp. 638 - 641
Main Authors Cerreta, E.K., Escobedo, J.P., Perez-Bergquist, A., Koller, D.D., Trujillo, C.P., Gray III, G.T., Brandl, C., Germann, T.C.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.05.2012
Subjects
Demage
Grain boundaries
Impact behavior
Microstructure
Grain boundaries
Demage
Impact behavior
Microstructure
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Summary:The role of grain boundary type in the early stages of dynamic damage evolution in copper has been investigated. Through a combination of polycrystalline and large-grained specimens, it has been shown that Σ3 and low-angle boundaries are resistant to void nucleation during shock loading to peak compressive stresses between 1.5 and 2.5GPa. It is postulated that these boundaries promote slip transmission or secondary slip activation and thereby relieve the stress concentrations necessary for void nucleation at a boundary.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2012.01.051