Residual stress analysis of SiO2 films deposited by plasma-enhanced chemical vapor deposition

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Bibliographic Details
Published inSurface & coatings technology Vol. 131; no. 1-3; pp. 153 - 157
Main Authors CHOI, Jin-Kyung, LEE, J, YOO, Ji-Beom, MAENG, Jong-Sun, KIM, Young-Man
Format Conference Proceeding Journal Article
LanguageEnglish
Published Lausanne Elsevier 01.09.2000
Subjects
Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Cross-disciplinary physics: materials science; rheology
Exact sciences and technology
Materials science
Methods of deposition of films and coatings; film growth and epitaxy
Physics
Thin films
CVD
Stress analysis
Growth stress
Temperature effects
Silicon oxides
Silazane copolymer
Residual stresses
PECVD
Experimental study
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ISSN:0257-8972
1879-3347
DOI:10.1016/s0257-8972(00)00753-2