Metal oxide resistive memory with a deterministic conduction path

Resistive random access memories (RRAMs) with minimal power dissipation, high speed, and matrix-vector multiplication capability are potentially ideal for data-centric applications such as neuromorphic computing. However, RRAMs still suffer from instability caused by uncontrolled filament growth and...

Full description

Saved in:
Bibliographic Details
Published inJournal of materials chemistry. C, Materials for optical and electronic devices Vol. 8; no. 11; pp. 3897 - 393
Main Authors Lee, Sunghwan, Seo, Shem, Lim, Jinho, Jeon, Dasom, Alimkhanuly, Batyrbek, Kadyrov, Arman, Lee, Seunghyun
Format Journal Article
LanguageEnglish
Published Cambridge Royal Society of Chemistry 21.03.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Resistive random access memories (RRAMs) with minimal power dissipation, high speed, and matrix-vector multiplication capability are potentially ideal for data-centric applications such as neuromorphic computing. However, RRAMs still suffer from instability caused by uncontrolled filament growth and random oxygen vacancy distribution. In this study, a Ge-Sb-Te ternary chalcogenide layer that functions as a conductive lead is added to a HfO 2 -based RRAM layer to confine the subsequent filament formation to the initially determined site. Based on the DC and pulse measurement data, this technique is confirmed to improve the memory switching reproducibility without compromising its endurance and retention. Such deterministic behavior will be important in improving the sensing margin and multi-level capability of RRAM technology as the switching characteristics become more unstable with extreme device scaling. In this study, a Ge-Sb-Te ternary chalcogenide layer that functions as a conductive lead is added to a HfO 2 -based RRAM layer to improve the memory switching reproducibility and reduce HRS/LRS variations.
Bibliography:10.1039/c9tc07001j
Electronic supplementary information (ESI) available. See DOI
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
ISSN:2050-7526
2050-7534
DOI:10.1039/c9tc07001j