Current induced degradation in GaAs HBT's

A physical model for observed current gain degradation in GaAs heterojunction bipolar transistors (HBT's) is suggested in terms of a parameterized mathematical description of accumulating junction damage. The model and measurement suggest a positive correlation between high initial values of DC...

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Bibliographic Details
Published inIEEE transactions on electron devices Vol. 47; no. 2; pp. 434 - 439
Main Authors Adlerstein, M.G., Gering, J.M.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.02.2000
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:A physical model for observed current gain degradation in GaAs heterojunction bipolar transistors (HBT's) is suggested in terms of a parameterized mathematical description of accumulating junction damage. The model and measurement suggest a positive correlation between high initial values of DC current gain and longer time to failure. Statistical analysis of accelerated stress failure data at 10 kA/cm/sup 2/ for InGaP-GaAs HBT's was conducted. The result shows projected median time to failure (MTTF) of more than 10/sup 8/ h at a junction temperature of 100/spl deg/C. The standard deviation is 0.6 and the activation energy is 1.5 eV.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9383
1557-9646
DOI:10.1109/16.822291