Preparation and thermo-physical parameters of diamond/W,Cu heat-conducting composite substrates
Diamond/W,Cu heat-conducting composite shims were produced by the multistep route. Initially, the surface of the microdiamonds ∼200 μm in size was covered by a W/WC layer using the deposition from a vapour of tungsten carbonyl. Then, the diamond/W,Cu pills were pressed from the mixture of W/WC-cover...
Saved in:
Published in | International journal of advanced manufacturing technology Vol. 86; no. 1-4; pp. 475 - 478 |
---|---|
Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
London
Springer London
01.09.2016
Springer Nature B.V |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Diamond/W,Cu heat-conducting composite shims were produced by the multistep route. Initially, the surface of the microdiamonds ∼200 μm in size was covered by a W/WC layer using the deposition from a vapour of tungsten carbonyl. Then, the diamond/W,Cu pills were pressed from the mixture of W/WC-covered diamonds and metal copper powder and the composite shims were sintered at 1270 K in vacuum. The thermal conductivity coefficient and coefficient of thermal expansion (CTE) measured for the diamond/W,Cu composite shims were as high as 450–650 W·m
−1
·K
−1
and 5.5–7.5 10
−6
/K, respectively. |
---|---|
ISSN: | 0268-3768 1433-3015 |
DOI: | 10.1007/s00170-015-8186-8 |