Preparation and thermo-physical parameters of diamond/W,Cu heat-conducting composite substrates

Diamond/W,Cu heat-conducting composite shims were produced by the multistep route. Initially, the surface of the microdiamonds ∼200 μm in size was covered by a W/WC layer using the deposition from a vapour of tungsten carbonyl. Then, the diamond/W,Cu pills were pressed from the mixture of W/WC-cover...

Full description

Saved in:
Bibliographic Details
Published inInternational journal of advanced manufacturing technology Vol. 86; no. 1-4; pp. 475 - 478
Main Authors Galashov, E. N., Yusuf, A. A., Mandrik, E. M., Atuchin, V. V.
Format Journal Article
LanguageEnglish
Published London Springer London 01.09.2016
Springer Nature B.V
Subjects
CAE) and Design
Carbonyls
Computer-Aided Engineering (CAD
Copper
Diamonds
Engineering
Heat transfer
Heat transmission
Industrial and Production Engineering
Mechanical Engineering
Media Management
Microdiamonds
Original Article
Physical properties
Sintering (powder metallurgy)
Substrates
Thermal conductivity
Thermal expansion
Tungsten
Tungsten carbide
Thermal properties
X-ray diffraction
Scanning electron microscopy
Chemical vapour deposition
Metal matrix composite
Online AccessGet full text

Cover

More Information
Summary:Diamond/W,Cu heat-conducting composite shims were produced by the multistep route. Initially, the surface of the microdiamonds ∼200 μm in size was covered by a W/WC layer using the deposition from a vapour of tungsten carbonyl. Then, the diamond/W,Cu pills were pressed from the mixture of W/WC-covered diamonds and metal copper powder and the composite shims were sintered at 1270 K in vacuum. The thermal conductivity coefficient and coefficient of thermal expansion (CTE) measured for the diamond/W,Cu composite shims were as high as 450–650 W·m −1 ·K −1 and 5.5–7.5 10 −6 /K, respectively.
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-015-8186-8