Thermal design for the package of high-power single-emitter laser diodes

• Published in: Optics and laser technology Vol. 129; p. 106266
• Main Authors: Wu, Di-Hai, Zah, Chung-En, Liu, Xingsheng
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.09.2020; Elsevier BV
• Subjects: Convective heat transfer; Diodes; Emitters; Enthalpy; Heat sink; Heat sinks; Heat spreading angle; Heat transmission; High-power laser diodes; Lasers; Semiconductor lasers; Spreading; Submount; Thermal analysis; Thermal design; Thermal energy; Thermal expansion; Thermal resistance; Three dimensional analysis; Three dimensional models; Submount; Heat spreading angle; Thermal resistance; Thermal design; Heat sink; High-power laser diodes
• ISSN: 0030-3992; 1879-2545
• DOI: 10.1016/j.optlastec.2020.106266

•An analytical 3-D thermal model is employed to design the package of high-power single-emitter laser diodes.•Thermal design curves for laser diode packages are presented in detail.•An effective heat spreading angle is proposed to characterize thermal design for the heat sink.•A differential heat spreading angle is proposed to manifest heat flow in laser diode packages.•Current heat sink design for commercial F-Mount laser diodes is discussed. An analytical three-dimensional thermal model is employed to perform the thermal design for the package of high-power single-emitter laser diodes. Thermal design curves for the heat sink and submount are presented in detail, for laser diodes subjected to several convective heat transfer conditions on the bottom of the heat sink. An effective heat spreading angle is proposed to characterize thermal design for the heat sink. A differential heat spreading angle is proposed to clearly manifest heat flow in the packages. Full width and length at 90% energy are introduced to reveal the requirement of submount width and length, respectively. The impact of coefficient of thermal expansion (CTE)-matched sandwiched submount on total heat dissipation is studied. Special discussion is presented for a commercial F-Mount laser diode, and it is found that current heat sink design leads to a 27.4% increase in thermal resistance relative to a free lateral diffusion package.