Uncovering the role of nanoscale Si particles on  the thermal stability of  a lamellar-nanostructured Al–1%Si alloy

• Published in: Materials research letters Vol. 12; no. 3; pp. 208 - 216
• Main Authors: Shuai, Linfei, Huang, Tianlin, Yu, Tianbo, Wu, Guilin, Huang, Xiaoxu
• Format: Journal Article
• Language: English
• Published: New York Taylor & Francis Ltd 03.03.2024; Taylor & Francis Group
• Subjects: Alloys; Aluminum; Annealing; Cold; Configurations; Grain boundaries; In-situ transmission electron microscopy; interconnecting incidental dislocation boundary; Lamellar structure; Lamellar-nanostructured Al alloys; Materials science; Mechanical engineering; Microstructure; nanoparticle; Nanoparticles; Nanostructure; Significant breakthrough in fundamental materials science; Silicon base alloys; Thermal stability; Transmission electron microscopy; Y junctions
• ISSN: 2166-3831; 2166-3831
• DOI: 10.1080/21663831.2024.2316198

This study investigates particle governed thermal stability in lamellar-nanostructured Al–1.0%Si using in-situ transmission electron microscopy and post-mortem observations. Microstructural coarsening, dominated by Y-junction motion, is correlated with dispersed Si nanoparticles. Si particles within lamellae efficiently hinder dislocation movement during deformation, fostering a configuration with Si particles along incidental dislocation boundaries (IDBs). This particle–IDB configuration significantly impedes Y-junction motion, retarding lamellar coarsening. The enhanced pinning force from particle–IDB synergy, combined with direct pinning by Si particles, contributes to improved thermal stability in lamellar-nanostructured Al–1.0%Si.