Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation

This paper presents a failure analysis result for enhancing the reliability of thermal inkjet printhead. A novel inkjet printhead is fabricated using MEMS process, and we analyze the failure mechanism of inkjet head based on detailed experimental observations and numerical simulations. The failures...

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Published inMicroelectronics and reliability Vol. 45; no. 3; pp. 473 - 478
Main Authors Lim, Ji-hyuk, Kuk, Keon, Shin, Seung-joo, Baek, Seog-soon, Kim, Young-jae, Shin, Jong-woo, Oh, Yong-soo
Format Journal Article
LanguageEnglish
Published Oxford Elsevier Ltd 01.03.2005
Elsevier
Subjects
Applied sciences
Electronics
Exact sciences and technology
Hardware
Input-output equipment
Micro- and nanoelectromechanical devices (mems/nems)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Testing, measurement, noise and reliability
Cavitation bubble
Print head
Durability
Thermal fatigue
Cavitation
Failures
Failure analysis
Numerical simulation
Electrodiffusion
Reliability
Microelectromechanical device
Ink jet printer
Damaging
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Summary:This paper presents a failure analysis result for enhancing the reliability of thermal inkjet printhead. A novel inkjet printhead is fabricated using MEMS process, and we analyze the failure mechanism of inkjet head based on detailed experimental observations and numerical simulations. The failures presented in this work showed three primary factors influencing the failure modes and lifetime of printhead; bubble cavitation damage, thermal fatigue, and electromigration of heater. The design modification of micro heater to avoid an early stage of failure by electromigration yields the reliability enhancement of thermal inkjet printhead.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2004.12.009