Dependence of intermetallic compound formation on the sublayer stacking sequence in Ag–Sn bilayer thin films

Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In...

Full description

Saved in:
Bibliographic Details
Published inActa materialia Vol. 103; pp. 174 - 183
Main Authors Rossi, P.J., Zotov, N., Bischoff, E., Mittemeijer, E.J.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 15.01.2016
Subjects
Formations
Interdiffusion
Intermetallic compounds
Intermetallic compounds (IMCs)
Intermetallics
Kinetics
Silver
Stacking
Thermodynamics
Thin films
Tin
Thin films
Thermodynamics
Interdiffusion
Intermetallic compounds (IMCs)
Kinetics
Online AccessGet full text

Cover

Abstract Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In case of Sn on top of Ag, predominantly Ag3Sn is formed, whereas Ag4Sn is predominantly present in the as-deposited state for Ag on top of Sn. In the latter case this is accompanied by an extremely fast uptake of a large amount of Sn by the Ag sublayer, leaving behind macroscopic voids in the Sn sublayer. The results are discussed on the basis of the thermodynamics and kinetics of (IMC) product-layer growth in thin films. It is shown that both thermodynamic and kinetic arguments explain the contrasting phenomena observed. [Display omitted]
AbstractList Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In case of Sn on top of Ag, predominantly Ag3Sn is formed, whereas Ag4Sn is predominantly present in the as-deposited state for Ag on top of Sn. In the latter case this is accompanied by an extremely fast uptake of a large amount of Sn by the Ag sublayer, leaving behind macroscopic voids in the Sn sublayer. The results are discussed on the basis of the thermodynamics and kinetics of (IMC) product-layer growth in thin films. It is shown that both thermodynamic and kinetic arguments explain the contrasting phenomena observed. [Display omitted]
Intermetallic compound (IMC) formation in thermally-evaporated Ag-Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In case of Sn on top of Ag, predominantly Ag3Sn is formed, whereas Ag4Sn is predominantly present in the as-deposited state for Ag on top of Sn. In the latter case this is accompanied by an extremely fast uptake of a large amount of Sn by the Ag sublayer, leaving behind macroscopic voids in the Sn sublayer. The results are discussed on the basis of the thermodynamics and kinetics of (IMC) product-layer growth in thin films. It is shown that both thermodynamic and kinetic arguments explain the contrasting phenomena observed.
Author Mittemeijer, E.J.
Rossi, P.J.
Zotov, N.
Bischoff, E.
Author_xml – sequence: 1
  givenname: P.J.
  surname: Rossi
  fullname: Rossi, P.J.
  email: p.rossi@is.mpg.de
  organization: Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), Heisenbergstraße 3, 70569 Stuttgart, Germany
– sequence: 2
  givenname: N.
  surname: Zotov
  fullname: Zotov, N.
  email: n.zotov@is.mpg.de
  organization: Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), Heisenbergstraße 3, 70569 Stuttgart, Germany
– sequence: 3
  givenname: E.
  surname: Bischoff
  fullname: Bischoff, E.
  email: e.bischoff@is.mpg.de
  organization: Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), Heisenbergstraße 3, 70569 Stuttgart, Germany
– sequence: 4
  givenname: E.J.
  surname: Mittemeijer
  fullname: Mittemeijer, E.J.
  email: e.j.mittemeijer@is.mpg.de
  organization: Max Planck Institute for Intelligent Systems (formerly Max Planck Institute for Metals Research), Heisenbergstraße 3, 70569 Stuttgart, Germany
BookMark eNqFkEtOwzAQhi1UJNrCEZC8ZJNgJ06crFBVnlIlFsDacpxJ65LYwXaQuuMO3JCTkNLukUaah_75NfPN0MRYAwhdUhJTQvPrbSxVkJ0McUJoFpMyJiw5QVNa8DRKWJZOxjrNyihnGTtDM--3hNCEMzJF5hZ6MDUYBdg2WJsAroMg21YrrGzX28HUuLFutNfW4DHCBrAfqlbuwGEfpHrXZo09fAx_Ltrgxfrn6_vF4EofRGEzDhvddv4cnTay9XBxzHP0dn_3unyMVs8PT8vFKlIpS0LE6rKipKgSxnhek6qqYOxZktJSKZ4ViqYFA5JJxqEgDEpGG85UzvO0aRSv0zm6Ovj2zo53-SA67RW0rTRgBy8oL_KEkDLnozQ7SJWz3jtoRO90J91OUCL2fMVWHPmKPV9BSrE_ZY5uDnsw_vGpwQmv9J5ArR2oIGqr_3H4BTyAipI
CitedBy_id crossref_primary_10_1063_1_4966593
crossref_primary_10_1007_s10854_021_06306_6
crossref_primary_10_1063_1_5094286
crossref_primary_10_1038_s41598_018_37103_7
crossref_primary_10_1007_s10853_018_1986_0
crossref_primary_10_1016_j_matchemphys_2021_124522
crossref_primary_10_1088_2053_1591_aad126
crossref_primary_10_1007_s11837_019_03544_2
crossref_primary_10_1016_j_actamat_2016_04_041
crossref_primary_10_1007_s11664_020_08148_0
crossref_primary_10_1007_s10854_018_00637_7
crossref_primary_10_1002_ppsc_202100161
crossref_primary_10_1016_j_matchemphys_2020_123490
crossref_primary_10_1039_D2LC00872F
crossref_primary_10_3139_146_111735
crossref_primary_10_1007_s40194_022_01289_2
crossref_primary_10_1016_j_jmrt_2023_05_091
Cites_doi 10.1016/0040-6090(91)90265-Y
10.1016/j.tca.2007.04.004
10.1063/1.1702428
10.1007/BF01111916
10.1063/1.336194
10.1016/0022-5096(96)00022-1
10.1080/14786430600640502
10.1016/0040-6090(75)90247-3
10.1080/10408439991329161
10.1016/0001-6160(55)90061-4
10.1063/1.91696
10.1016/0040-6090(79)90457-7
10.1116/1.572727
10.1179/026708303225009706
10.1063/1.331028
10.1023/A:1004317123677
10.1109/96.554534
10.1016/j.jallcom.2013.03.234
10.1016/0040-6090(87)90069-1
10.1116/1.1312732
10.1063/1.345369
10.1557/JMR.2002.0402
10.1063/1.368794
10.1088/0305-4608/9/1/006
10.1016/S1359-6454(00)00372-4
10.1016/j.actamat.2014.05.006
10.1080/14786436108244417
10.1016/j.actamat.2008.07.022
10.1016/0039-6028(92)90188-C
10.1016/0040-6090(81)90468-5
10.1016/S1359-0286(00)00036-X
10.1063/1.1708821
10.1103/PhysRev.96.610
10.1016/0378-5963(83)90049-1
10.1016/S0039-6028(98)00363-X
10.1016/j.actamat.2008.08.002
10.1016/S0254-0584(02)00192-X
10.1007/BF02869270
10.1007/s11664-004-0021-1
10.1016/0001-6160(67)90191-5
ContentType Journal Article
Copyright 2015 Acta Materialia Inc.
Copyright_xml – notice: 2015 Acta Materialia Inc.
DBID AAYXX
CITATION
7SR
8BQ
8FD
JG9
DOI 10.1016/j.actamat.2015.09.042
DatabaseName CrossRef
Engineered Materials Abstracts
METADEX
Technology Research Database
Materials Research Database
DatabaseTitle CrossRef
Materials Research Database
Engineered Materials Abstracts
Technology Research Database
METADEX
DatabaseTitleList
Materials Research Database
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 1873-2453
EndPage 183
ExternalDocumentID 10_1016_j_actamat_2015_09_042
S1359645415007235
GroupedDBID --K
--M
-~X
.~1
0R~
1B1
1~.
1~5
23M
4.4
457
4G.
5GY
5VS
7-5
71M
8P~
AABNK
AABXZ
AACTN
AAEDT
AAEDW
AAEPC
AAIAV
AAIKJ
AAKOC
AALRI
AAOAW
AAQFI
AAXUO
ABFNM
ABMAC
ABNEU
ABXRA
ABYKQ
ACDAQ
ACGFS
ACRLP
ADBBV
ADEZE
AEBSH
AEKER
AENEX
AEZYN
AFKWA
AFRZQ
AFTJW
AGHFR
AGUBO
AGYEJ
AIEXJ
AIKHN
AITUG
AIVDX
AJBFU
AJOXV
ALMA_UNASSIGNED_HOLDINGS
AMFUW
AMRAJ
AXJTR
BKOJK
BLXMC
CS3
EBS
EFJIC
EFLBG
EJD
EO8
EO9
EP2
EP3
F5P
FDB
FEDTE
FIRID
FNPLU
FYGXN
G-Q
GBLVA
HVGLF
HZ~
IHE
J1W
KOM
M41
MAGPM
N9A
O-L
O9-
OAUVE
OGIMB
OZT
P-8
P-9
PC.
Q38
RIG
RNS
ROL
RPZ
SDF
SDG
SDP
SES
SPC
SPCBC
SPD
SSM
SSQ
SSZ
T5K
TN5
XPP
ZMT
~G-
AAQXK
AAXKI
AAYXX
ABTAH
ABXDB
ACNNM
ADIYS
ADMUD
AFFNX
AKRWK
ASPBG
AVWKF
AZFZN
CITATION
FGOYB
R2-
SEW
T9H
ZY4
7SR
8BQ
8FD
JG9
ID FETCH-LOGICAL-c342t-4d9b108b24476d0bbbeb1042319cc758c1384e05a47e804e941f74c6763ffc7d3
IEDL.DBID .~1
ISSN 1359-6454
IngestDate Fri Aug 16 05:59:53 EDT 2024
Thu Sep 12 19:08:34 EDT 2024
Fri Feb 23 02:41:48 EST 2024
IsPeerReviewed true
IsScholarly true
Keywords Thin films
Thermodynamics
Interdiffusion
Intermetallic compounds (IMCs)
Kinetics
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c342t-4d9b108b24476d0bbbeb1042319cc758c1384e05a47e804e941f74c6763ffc7d3
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
PQID 1786200967
PQPubID 23500
PageCount 10
ParticipantIDs proquest_miscellaneous_1786200967
crossref_primary_10_1016_j_actamat_2015_09_042
elsevier_sciencedirect_doi_10_1016_j_actamat_2015_09_042
PublicationCentury 2000
PublicationDate 2016-01-15
PublicationDateYYYYMMDD 2016-01-15
PublicationDate_xml – month: 01
  year: 2016
  text: 2016-01-15
  day: 15
PublicationDecade 2010
PublicationTitle Acta materialia
PublicationYear 2016
Publisher Elsevier Ltd
Publisher_xml – name: Elsevier Ltd
References Dyson (bib0070) 1966; 37
Golan, Margulis, Rubinstein (bib0130) 1992; 264
Tu, Chan, Lai (bib0050) 1997; 20
Kim, Kim, Yu, Lee (bib0055) 2004; 33
Cros, Aboelfotoh, Tu (bib0225) 1990; 67
Simić, Marinković (bib0105) 1979; 61
Osório, Peixoto, Garcia, Mangelinck-Noël, Garcia (bib0035) 2013; 572
Yu, Kim (bib0195) 2008; 56
Karakaya, Thompson (bib0065) 1987; 8
Parent, Chung, Bernstein (bib0045) 1988; 23
de Boer, Boom, Mattens (bib0210) 1988
Geguzin, Kaganovskiy, Paritskaya, Solunskiy (bib0270) 1979; 47
Henderson, Gosselin, Sarkhel, Kang, Choi, Shih, Goldsmith, Puttlitz (bib0040) 2002; 17
Ibrahim, Balogh, Stender, Schlesiger, Greiwe, Schmitz, Parditka, Langer, Csik, Erdélyi (bib0230) 2014; 76
Stearns, Lee, Chang, Petford-Long (bib0145) 1988
Flandorfer, Saeed, Luef, Sabbar, Ipser (bib0245) 2007; 459
Kleppa (bib0250) 1955; 3
Rossi, Zotov, Mittemeijer (bib0155) 2015
Rossi, Zotov, Mittemeijer (bib0240) 2014
Murphy (bib0060) 1926; 35
(bib0120) 2005
Mittemeijer (bib0265) 2010
Hirth, Lothe (bib0175) 1982
Nakahara, McCoy (bib0200) 1980; 37
Thornton (bib0125) 1974; 11
King, Massalski (bib0150) 1961; 6
Marinković, Simić (bib0090) 1991; 195
Nakahara, McCoy, Buene, Vandenberg (bib0205) 1981; 84
(bib0115) 2007
Sommadossi, Gust, Mittemeijer (bib0020) 2003; 19
European Commission (bib0010) 2003; L37
Largeron, Quesnel, Thibault (bib0235) 2006; 86
Sommadossi, Gust, Mittemeijer (bib0015) 2003; 77
Frank, Falconer (bib0220) 1983; 14
Simić, Marinković (bib0100) 1998; 33
Pretorius, Theron, Vantomme, Mayer (bib0255) 1999; 24
Lee (bib0025) 1999; 26
Tang, He, Liu, Ivey (bib0110) 2008; 56
Gottstein (bib0180) 2004
Greiser, Müllner, Arzt (bib0190) 2001; 49
Dong, Srolovitz (bib0140) 1998; 84
Tomizuka, Slifkin (bib0085) 1954; 96
Suganuma (bib0030) 2001; 5
Gale, Totemeier (bib0260) 2004
Adler, Wagner (bib0170) 1962; 33
Thompson, Carel (bib0135) 1996; 44
Sen, Ghorai, Bandyopadhyay, Sen (bib0095) 1987; 155
Hentzell, Grovenor, Smith (bib0160) 1984; 2
Gösele, Tu (bib0275) 1982; 53
Nylandsted Larsen, Weyer (bib0080) 1979; 9
Vitos, Ruban, Skriver, Kollár (bib0215) 1998; 411
Ruff, Ives (bib0165) 1967; 15
Thompson (bib0185) 1985; 58
Warburton, Turnbull (bib0075) 1975; 25
Tang (10.1016/j.actamat.2015.09.042_bib0110) 2008; 56
de Boer (10.1016/j.actamat.2015.09.042_bib0210) 1988
Thompson (10.1016/j.actamat.2015.09.042_bib0135) 1996; 44
Simić (10.1016/j.actamat.2015.09.042_bib0100) 1998; 33
Warburton (10.1016/j.actamat.2015.09.042_bib0075) 1975; 25
Suganuma (10.1016/j.actamat.2015.09.042_bib0030) 2001; 5
(10.1016/j.actamat.2015.09.042_bib0115) 2007
Hirth (10.1016/j.actamat.2015.09.042_bib0175) 1982
King (10.1016/j.actamat.2015.09.042_bib0150) 1961; 6
Kim (10.1016/j.actamat.2015.09.042_bib0055) 2004; 33
Gösele (10.1016/j.actamat.2015.09.042_bib0275) 1982; 53
Ibrahim (10.1016/j.actamat.2015.09.042_bib0230) 2014; 76
Sen (10.1016/j.actamat.2015.09.042_bib0095) 1987; 155
Adler (10.1016/j.actamat.2015.09.042_bib0170) 1962; 33
Geguzin (10.1016/j.actamat.2015.09.042_bib0270) 1979; 47
Osório (10.1016/j.actamat.2015.09.042_bib0035) 2013; 572
Pretorius (10.1016/j.actamat.2015.09.042_bib0255) 1999; 24
Greiser (10.1016/j.actamat.2015.09.042_bib0190) 2001; 49
Sommadossi (10.1016/j.actamat.2015.09.042_bib0015) 2003; 77
Stearns (10.1016/j.actamat.2015.09.042_bib0145) 1988
Rossi (10.1016/j.actamat.2015.09.042_bib0155) 2015
Thompson (10.1016/j.actamat.2015.09.042_bib0185) 1985; 58
Nakahara (10.1016/j.actamat.2015.09.042_bib0200) 1980; 37
Lee (10.1016/j.actamat.2015.09.042_bib0025) 1999; 26
Hentzell (10.1016/j.actamat.2015.09.042_bib0160) 1984; 2
Frank (10.1016/j.actamat.2015.09.042_bib0220) 1983; 14
Parent (10.1016/j.actamat.2015.09.042_bib0045) 1988; 23
(10.1016/j.actamat.2015.09.042_bib0120) 2005
Ruff (10.1016/j.actamat.2015.09.042_bib0165) 1967; 15
Gale (10.1016/j.actamat.2015.09.042_bib0260) 2004
Tu (10.1016/j.actamat.2015.09.042_bib0050) 1997; 20
Simić (10.1016/j.actamat.2015.09.042_bib0105) 1979; 61
Yu (10.1016/j.actamat.2015.09.042_bib0195) 2008; 56
Nakahara (10.1016/j.actamat.2015.09.042_bib0205) 1981; 84
Flandorfer (10.1016/j.actamat.2015.09.042_bib0245) 2007; 459
Nylandsted Larsen (10.1016/j.actamat.2015.09.042_bib0080) 1979; 9
Henderson (10.1016/j.actamat.2015.09.042_bib0040) 2002; 17
Tomizuka (10.1016/j.actamat.2015.09.042_bib0085) 1954; 96
Sommadossi (10.1016/j.actamat.2015.09.042_bib0020) 2003; 19
Marinković (10.1016/j.actamat.2015.09.042_bib0090) 1991; 195
Mittemeijer (10.1016/j.actamat.2015.09.042_bib0265) 2010
Thornton (10.1016/j.actamat.2015.09.042_bib0125) 1974; 11
Gottstein (10.1016/j.actamat.2015.09.042_bib0180) 2004
Rossi (10.1016/j.actamat.2015.09.042_bib0240) 2014
Golan (10.1016/j.actamat.2015.09.042_bib0130) 1992; 264
Cros (10.1016/j.actamat.2015.09.042_bib0225) 1990; 67
Dyson (10.1016/j.actamat.2015.09.042_bib0070) 1966; 37
European Commission (10.1016/j.actamat.2015.09.042_bib0010) 2003; L37
Karakaya (10.1016/j.actamat.2015.09.042_bib0065) 1987; 8
Largeron (10.1016/j.actamat.2015.09.042_bib0235) 2006; 86
Vitos (10.1016/j.actamat.2015.09.042_bib0215) 1998; 411
Murphy (10.1016/j.actamat.2015.09.042_bib0060) 1926; 35
Kleppa (10.1016/j.actamat.2015.09.042_bib0250) 1955; 3
Dong (10.1016/j.actamat.2015.09.042_bib0140) 1998; 84
References_xml – volume: 3
  start-page: 255
  year: 1955
  end-page: 259
  ident: bib0250
  article-title: A calorimetric investigation of the system silver-tin at 450 °C
  publication-title: Acta Metal
  contributor:
    fullname: Kleppa
– volume: 23
  start-page: 2564
  year: 1988
  end-page: 2572
  ident: bib0045
  article-title: Effects of intermetallic formation at the interface between copper and lead-tin solder
  publication-title: J. Mater. Sci
  contributor:
    fullname: Bernstein
– year: 2015
  ident: bib0155
  article-title: Redetermination of the crystal structure of Ag
  publication-title: Z. Kristallogr
  contributor:
    fullname: Mittemeijer
– volume: 58
  start-page: 763
  year: 1985
  end-page: 772
  ident: bib0185
  article-title: Secondary grain growth in thin films of semiconductors: theoretical aspects
  publication-title: J. Appl. Phys
  contributor:
    fullname: Thompson
– volume: 33
  start-page: 3451
  year: 1962
  end-page: 3458
  ident: bib0170
  article-title: X-Ray diffraction study of the effects of solutes on the occurrence of stacking faults in silver-base alloys
  publication-title: J. Appl. Phys
  contributor:
    fullname: Wagner
– volume: 8
  start-page: 340
  year: 1987
  end-page: 347
  ident: bib0065
  article-title: The Ag-Sn (silver-tin) system
  publication-title: Bull. Alloy Phase Diagr
  contributor:
    fullname: Thompson
– volume: 76
  start-page: 306
  year: 2014
  end-page: 313
  ident: bib0230
  article-title: On the influence of the stacking sequence in the nucleation of Cu
  publication-title: Acta Mater
  contributor:
    fullname: Erdélyi
– volume: 33
  start-page: 948
  year: 2004
  end-page: 957
  ident: bib0055
  article-title: Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint
  publication-title: J. Electron. Mater
  contributor:
    fullname: Lee
– volume: 2
  start-page: 218
  year: 1984
  end-page: 219
  ident: bib0160
  article-title: Grain structure variation with temperature for evaporated metal films
  publication-title: J. Vac. Sci. Technol. A Vac. Surf. Films
  contributor:
    fullname: Smith
– volume: 37
  start-page: 42
  year: 1980
  end-page: 44
  ident: bib0200
  article-title: Kirkendall void formation in thin-film diffusion couples
  publication-title: Appl. Phys. Lett
  contributor:
    fullname: McCoy
– volume: 37
  start-page: 2375
  year: 1966
  end-page: 2377
  ident: bib0070
  article-title: Diffusion of gold and silver in tin single crystals
  publication-title: J. Appl. Phys
  contributor:
    fullname: Dyson
– volume: 61
  start-page: 149
  year: 1979
  end-page: 160
  ident: bib0105
  article-title: Room temperature interactions in Ag-metals thin film couples
  publication-title: Thin Solid Films
  contributor:
    fullname: Marinković
– volume: 11
  start-page: 666
  year: 1974
  end-page: 670
  ident: bib0125
  article-title: Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
  publication-title: J. Vac. Sci. Technol
  contributor:
    fullname: Thornton
– year: 2005
  ident: bib0120
  publication-title: Introduction to Focused Ion Beams
– volume: 56
  start-page: 5818
  year: 2008
  end-page: 5827
  ident: bib0110
  article-title: Room temperature interfacial reactions in electrodeposited Au/Sn couples
  publication-title: Acta Mater
  contributor:
    fullname: Ivey
– volume: 84
  start-page: 185
  year: 1981
  end-page: 196
  ident: bib0205
  article-title: Room temperature interdiffusion studies of Au/Sn thin film couples
  publication-title: Thin Solid Films
  contributor:
    fullname: Vandenberg
– start-page: 55
  year: 1988
  end-page: 75
  ident: bib0145
  article-title: Magnetic, X-ray and TEM studies of several multilayer systems
  publication-title: Metallic Multi-layers and Epitaxy. Proceedings of a Symposium
  contributor:
    fullname: Petford-Long
– volume: 459
  start-page: 34
  year: 2007
  end-page: 39
  ident: bib0245
  article-title: Interfaces in lead-free solder alloys: enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds
  publication-title: Thermochim. Acta
  contributor:
    fullname: Ipser
– volume: 24
  start-page: 1
  year: 1999
  end-page: 62
  ident: bib0255
  article-title: Compound phase formation in thin film structures
  publication-title: Crit. Rev. Solid State Mater. Sci
  contributor:
    fullname: Mayer
– volume: 25
  start-page: 71
  year: 1975
  end-page: 76
  ident: bib0075
  article-title: “Fast” diffusion in alloys
  publication-title: Thin Solid Films
  contributor:
    fullname: Turnbull
– volume: 47
  start-page: 127
  year: 1979
  end-page: 138
  ident: bib0270
  article-title: Kinetics of the motion of the interface during mutual diffusion in a two-component system
  publication-title: Phys. Met. Metallogr
  contributor:
    fullname: Solunskiy
– year: 1982
  ident: bib0175
  article-title: Theory of Dislocations
  contributor:
    fullname: Lothe
– year: 1988
  ident: bib0210
  article-title: Cohesion in Metals
  contributor:
    fullname: Mattens
– volume: 14
  start-page: 359
  year: 1983
  end-page: 374
  ident: bib0220
  article-title: Surface compositions of copper-silicon alloys
  publication-title: Appl. Surf. Sci
  contributor:
    fullname: Falconer
– volume: 84
  start-page: 5261
  year: 1998
  end-page: 5269
  ident: bib0140
  article-title: Study on texture evolution and properties of silver thin films prepared by sputtering deposition
  publication-title: J. Appl. Phys
  contributor:
    fullname: Srolovitz
– year: 2004
  ident: bib0180
  article-title: Physical Foundations of Materials Science
  contributor:
    fullname: Gottstein
– volume: 96
  start-page: 610
  year: 1954
  end-page: 615
  ident: bib0085
  article-title: Diffusion of cadmium, indium, and tin in single crystals of silver
  publication-title: Phys. Rev
  contributor:
    fullname: Slifkin
– volume: 56
  start-page: 5514
  year: 2008
  end-page: 5523
  ident: bib0195
  article-title: Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints
  publication-title: Acta Mater
  contributor:
    fullname: Kim
– year: 2004
  ident: bib0260
  article-title: Smithells Metals Reference Book
  contributor:
    fullname: Totemeier
– volume: 572
  start-page: 97
  year: 2013
  end-page: 106
  ident: bib0035
  article-title: Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
  publication-title: J. Alloys Compd
  contributor:
    fullname: Garcia
– volume: 195
  start-page: 127
  year: 1991
  end-page: 136
  ident: bib0090
  article-title: Kinetics of reaction at room temperature in thin silver-metal couples
  publication-title: Thin Solid Films
  contributor:
    fullname: Simić
– volume: 44
  start-page: 657
  year: 1996
  end-page: 673
  ident: bib0135
  article-title: Stress and grain growth in thin films
  publication-title: J. Mech. Phys. Solids
  contributor:
    fullname: Carel
– volume: 77
  start-page: 924
  year: 2003
  end-page: 929
  ident: bib0015
  article-title: Characterization of the reaction process in diffusion-soldered Cu/In-48 at.% Sn/Cu joints
  publication-title: Mater. Chem. Phys
  contributor:
    fullname: Mittemeijer
– volume: 19
  start-page: 528
  year: 2003
  end-page: 534
  ident: bib0020
  article-title: Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections
  publication-title: Mater. Sci. Technol
  contributor:
    fullname: Mittemeijer
– volume: 411
  start-page: 186
  year: 1998
  end-page: 202
  ident: bib0215
  article-title: The surface energy of metals
  publication-title: Surf. Sci
  contributor:
    fullname: Kollár
– volume: 35
  start-page: 107
  year: 1926
  end-page: 129
  ident: bib0060
  article-title: Constitution of the alloys of silver and tin
  publication-title: J. Inst. Met
  contributor:
    fullname: Murphy
– start-page: 41
  year: 2014
  ident: bib0240
  publication-title: 9th European Conference on Residual Stresses (ECRS-9)
  contributor:
    fullname: Mittemeijer
– volume: L37
  start-page: 19
  year: 2003
  end-page: 23
  ident: bib0010
  article-title: Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
  publication-title: Off. J. Eur. Communities
  contributor:
    fullname: European Commission
– volume: 17
  start-page: 2775
  year: 2002
  end-page: 2778
  ident: bib0040
  article-title: Ag
  publication-title: J. Mater. Res
  contributor:
    fullname: Puttlitz
– volume: 26
  start-page: 29
  year: 1999
  end-page: 35
  ident: bib0025
  article-title: Lead-free soldering – where the world is going
  publication-title: Adv. Microelectron
  contributor:
    fullname: Lee
– volume: 20
  start-page: 87
  year: 1997
  end-page: 93
  ident: bib0050
  article-title: Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
  publication-title: IEEE Trans. Compon. Packag. Manuf. Technol. Part B
  contributor:
    fullname: Lai
– volume: 5
  start-page: 55
  year: 2001
  end-page: 64
  ident: bib0030
  article-title: Advances in lead-free electronics soldering
  publication-title: Curr. Opin. Solid State Mater. Sci
  contributor:
    fullname: Suganuma
– volume: 67
  start-page: 3328
  year: 1990
  end-page: 3336
  ident: bib0225
  article-title: Formation, oxidation, electronic, and electrical properties of copper silicides
  publication-title: J. Appl. Phys
  contributor:
    fullname: Tu
– volume: 15
  start-page: 189
  year: 1967
  end-page: 198
  ident: bib0165
  article-title: Dislocation node determinations of the stacking fault energy in silver-tin alloys
  publication-title: Acta Metal
  contributor:
    fullname: Ives
– volume: 264
  start-page: 312
  year: 1992
  end-page: 326
  ident: bib0130
  article-title: Vacuum-deposited gold films. I. Factors affecting the film morphology
  publication-title: Surf. Sci
  contributor:
    fullname: Rubinstein
– volume: 155
  start-page: 243
  year: 1987
  end-page: 253
  ident: bib0095
  article-title: Interfacial reactions in bimetallic Ag-Sn thin film couples
  publication-title: Thin Solid Films
  contributor:
    fullname: Sen
– volume: 86
  start-page: 2865
  year: 2006
  end-page: 2879
  ident: bib0235
  article-title: Interface growth mechanism in ion beam sputtering-deposited Mo/Si multilayers
  publication-title: Philos. Mag
  contributor:
    fullname: Thibault
– volume: 53
  start-page: 3252
  year: 1982
  end-page: 3260
  ident: bib0275
  article-title: Growth kinetics of planar binary diffusion couples: “Thin-film case” versus “bulk cases”
  publication-title: J. Appl. Phys
  contributor:
    fullname: Tu
– year: 2007
  ident: bib0115
  publication-title: Handbook of Silicon Wafer Cleaning Technology (Materials Science and Process Technology)
– volume: 6
  start-page: 669
  year: 1961
  end-page: 682
  ident: bib0150
  article-title: Lattice spacing relationships and the electronic structure of H.C.P. phases based on silver
  publication-title: Philos. Mag
  contributor:
    fullname: Massalski
– volume: 9
  start-page: 27
  year: 1979
  end-page: 37
  ident: bib0080
  article-title: Mössbauer spectroscopy of isotope separator implanted
  publication-title: J. Phys. F. Met. Phys
  contributor:
    fullname: Weyer
– volume: 33
  start-page: 561
  year: 1998
  end-page: 624
  ident: bib0100
  article-title: Room-temperature reactions in thin metal couples
  publication-title: J. Mater. Sci
  contributor:
    fullname: Marinković
– start-page: 371
  year: 2010
  end-page: 461
  ident: bib0265
  article-title: Fundamentals of Materials Science
  contributor:
    fullname: Mittemeijer
– volume: 49
  start-page: 1041
  year: 2001
  end-page: 1050
  ident: bib0190
  article-title: Abnormal growth of “giant” grains in silver thin films
  publication-title: Acta Mater
  contributor:
    fullname: Arzt
– volume: 195
  start-page: 127
  year: 1991
  ident: 10.1016/j.actamat.2015.09.042_bib0090
  article-title: Kinetics of reaction at room temperature in thin silver-metal couples
  publication-title: Thin Solid Films
  doi: 10.1016/0040-6090(91)90265-Y
  contributor:
    fullname: Marinković
– volume: 459
  start-page: 34
  year: 2007
  ident: 10.1016/j.actamat.2015.09.042_bib0245
  article-title: Interfaces in lead-free solder alloys: enthalpy of formation of binary Ag-Sn, Cu-Sn and Ni-Sn intermetallic compounds
  publication-title: Thermochim. Acta
  doi: 10.1016/j.tca.2007.04.004
  contributor:
    fullname: Flandorfer
– start-page: 41
  year: 2014
  ident: 10.1016/j.actamat.2015.09.042_bib0240
  contributor:
    fullname: Rossi
– volume: 33
  start-page: 3451
  year: 1962
  ident: 10.1016/j.actamat.2015.09.042_bib0170
  article-title: X-Ray diffraction study of the effects of solutes on the occurrence of stacking faults in silver-base alloys
  publication-title: J. Appl. Phys
  doi: 10.1063/1.1702428
  contributor:
    fullname: Adler
– volume: 47
  start-page: 127
  year: 1979
  ident: 10.1016/j.actamat.2015.09.042_bib0270
  article-title: Kinetics of the motion of the interface during mutual diffusion in a two-component system
  publication-title: Phys. Met. Metallogr
  contributor:
    fullname: Geguzin
– volume: 23
  start-page: 2564
  year: 1988
  ident: 10.1016/j.actamat.2015.09.042_bib0045
  article-title: Effects of intermetallic formation at the interface between copper and lead-tin solder
  publication-title: J. Mater. Sci
  doi: 10.1007/BF01111916
  contributor:
    fullname: Parent
– volume: 58
  start-page: 763
  year: 1985
  ident: 10.1016/j.actamat.2015.09.042_bib0185
  article-title: Secondary grain growth in thin films of semiconductors: theoretical aspects
  publication-title: J. Appl. Phys
  doi: 10.1063/1.336194
  contributor:
    fullname: Thompson
– volume: 44
  start-page: 657
  year: 1996
  ident: 10.1016/j.actamat.2015.09.042_bib0135
  article-title: Stress and grain growth in thin films
  publication-title: J. Mech. Phys. Solids
  doi: 10.1016/0022-5096(96)00022-1
  contributor:
    fullname: Thompson
– year: 1988
  ident: 10.1016/j.actamat.2015.09.042_bib0210
  contributor:
    fullname: de Boer
– volume: L37
  start-page: 19
  year: 2003
  ident: 10.1016/j.actamat.2015.09.042_bib0010
  article-title: Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
  publication-title: Off. J. Eur. Communities
  contributor:
    fullname: European Commission
– volume: 86
  start-page: 2865
  year: 2006
  ident: 10.1016/j.actamat.2015.09.042_bib0235
  article-title: Interface growth mechanism in ion beam sputtering-deposited Mo/Si multilayers
  publication-title: Philos. Mag
  doi: 10.1080/14786430600640502
  contributor:
    fullname: Largeron
– volume: 25
  start-page: 71
  year: 1975
  ident: 10.1016/j.actamat.2015.09.042_bib0075
  article-title: “Fast” diffusion in alloys
  publication-title: Thin Solid Films
  doi: 10.1016/0040-6090(75)90247-3
  contributor:
    fullname: Warburton
– volume: 35
  start-page: 107
  year: 1926
  ident: 10.1016/j.actamat.2015.09.042_bib0060
  article-title: Constitution of the alloys of silver and tin
  publication-title: J. Inst. Met
  contributor:
    fullname: Murphy
– volume: 24
  start-page: 1
  year: 1999
  ident: 10.1016/j.actamat.2015.09.042_bib0255
  article-title: Compound phase formation in thin film structures
  publication-title: Crit. Rev. Solid State Mater. Sci
  doi: 10.1080/10408439991329161
  contributor:
    fullname: Pretorius
– volume: 3
  start-page: 255
  year: 1955
  ident: 10.1016/j.actamat.2015.09.042_bib0250
  article-title: A calorimetric investigation of the system silver-tin at 450 °C
  publication-title: Acta Metal
  doi: 10.1016/0001-6160(55)90061-4
  contributor:
    fullname: Kleppa
– volume: 37
  start-page: 42
  year: 1980
  ident: 10.1016/j.actamat.2015.09.042_bib0200
  article-title: Kirkendall void formation in thin-film diffusion couples
  publication-title: Appl. Phys. Lett
  doi: 10.1063/1.91696
  contributor:
    fullname: Nakahara
– year: 2015
  ident: 10.1016/j.actamat.2015.09.042_bib0155
  article-title: Redetermination of the crystal structure of Ag3Sn
  publication-title: Z. Kristallogr
  contributor:
    fullname: Rossi
– volume: 61
  start-page: 149
  year: 1979
  ident: 10.1016/j.actamat.2015.09.042_bib0105
  article-title: Room temperature interactions in Ag-metals thin film couples
  publication-title: Thin Solid Films
  doi: 10.1016/0040-6090(79)90457-7
  contributor:
    fullname: Simić
– volume: 2
  start-page: 218
  year: 1984
  ident: 10.1016/j.actamat.2015.09.042_bib0160
  article-title: Grain structure variation with temperature for evaporated metal films
  publication-title: J. Vac. Sci. Technol. A Vac. Surf. Films
  doi: 10.1116/1.572727
  contributor:
    fullname: Hentzell
– volume: 19
  start-page: 528
  year: 2003
  ident: 10.1016/j.actamat.2015.09.042_bib0020
  article-title: Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections
  publication-title: Mater. Sci. Technol
  doi: 10.1179/026708303225009706
  contributor:
    fullname: Sommadossi
– volume: 53
  start-page: 3252
  year: 1982
  ident: 10.1016/j.actamat.2015.09.042_bib0275
  article-title: Growth kinetics of planar binary diffusion couples: “Thin-film case” versus “bulk cases”
  publication-title: J. Appl. Phys
  doi: 10.1063/1.331028
  contributor:
    fullname: Gösele
– volume: 33
  start-page: 561
  year: 1998
  ident: 10.1016/j.actamat.2015.09.042_bib0100
  article-title: Room-temperature reactions in thin metal couples
  publication-title: J. Mater. Sci
  doi: 10.1023/A:1004317123677
  contributor:
    fullname: Simić
– volume: 20
  start-page: 87
  year: 1997
  ident: 10.1016/j.actamat.2015.09.042_bib0050
  article-title: Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
  publication-title: IEEE Trans. Compon. Packag. Manuf. Technol. Part B
  doi: 10.1109/96.554534
  contributor:
    fullname: Tu
– volume: 572
  start-page: 97
  year: 2013
  ident: 10.1016/j.actamat.2015.09.042_bib0035
  article-title: Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys
  publication-title: J. Alloys Compd
  doi: 10.1016/j.jallcom.2013.03.234
  contributor:
    fullname: Osório
– volume: 155
  start-page: 243
  year: 1987
  ident: 10.1016/j.actamat.2015.09.042_bib0095
  article-title: Interfacial reactions in bimetallic Ag-Sn thin film couples
  publication-title: Thin Solid Films
  doi: 10.1016/0040-6090(87)90069-1
  contributor:
    fullname: Sen
– volume: 11
  start-page: 666
  year: 1974
  ident: 10.1016/j.actamat.2015.09.042_bib0125
  article-title: Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings
  publication-title: J. Vac. Sci. Technol
  doi: 10.1116/1.1312732
  contributor:
    fullname: Thornton
– volume: 67
  start-page: 3328
  year: 1990
  ident: 10.1016/j.actamat.2015.09.042_bib0225
  article-title: Formation, oxidation, electronic, and electrical properties of copper silicides
  publication-title: J. Appl. Phys
  doi: 10.1063/1.345369
  contributor:
    fullname: Cros
– year: 2007
  ident: 10.1016/j.actamat.2015.09.042_bib0115
– volume: 17
  start-page: 2775
  year: 2002
  ident: 10.1016/j.actamat.2015.09.042_bib0040
  article-title: Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
  publication-title: J. Mater. Res
  doi: 10.1557/JMR.2002.0402
  contributor:
    fullname: Henderson
– volume: 84
  start-page: 5261
  year: 1998
  ident: 10.1016/j.actamat.2015.09.042_bib0140
  article-title: Study on texture evolution and properties of silver thin films prepared by sputtering deposition
  publication-title: J. Appl. Phys
  doi: 10.1063/1.368794
  contributor:
    fullname: Dong
– year: 1982
  ident: 10.1016/j.actamat.2015.09.042_bib0175
  contributor:
    fullname: Hirth
– volume: 9
  start-page: 27
  year: 1979
  ident: 10.1016/j.actamat.2015.09.042_bib0080
  article-title: Mössbauer spectroscopy of isotope separator implanted 119Sn in fcc metals
  publication-title: J. Phys. F. Met. Phys
  doi: 10.1088/0305-4608/9/1/006
  contributor:
    fullname: Nylandsted Larsen
– volume: 49
  start-page: 1041
  year: 2001
  ident: 10.1016/j.actamat.2015.09.042_bib0190
  article-title: Abnormal growth of “giant” grains in silver thin films
  publication-title: Acta Mater
  doi: 10.1016/S1359-6454(00)00372-4
  contributor:
    fullname: Greiser
– year: 2005
  ident: 10.1016/j.actamat.2015.09.042_bib0120
– start-page: 55
  year: 1988
  ident: 10.1016/j.actamat.2015.09.042_bib0145
  article-title: Magnetic, X-ray and TEM studies of several multilayer systems
  contributor:
    fullname: Stearns
– volume: 76
  start-page: 306
  year: 2014
  ident: 10.1016/j.actamat.2015.09.042_bib0230
  article-title: On the influence of the stacking sequence in the nucleation of Cu3Si: experiment and the testing of nucleation models
  publication-title: Acta Mater
  doi: 10.1016/j.actamat.2014.05.006
  contributor:
    fullname: Ibrahim
– volume: 6
  start-page: 669
  year: 1961
  ident: 10.1016/j.actamat.2015.09.042_bib0150
  article-title: Lattice spacing relationships and the electronic structure of H.C.P. phases based on silver
  publication-title: Philos. Mag
  doi: 10.1080/14786436108244417
  contributor:
    fullname: King
– volume: 56
  start-page: 5514
  year: 2008
  ident: 10.1016/j.actamat.2015.09.042_bib0195
  article-title: Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints
  publication-title: Acta Mater
  doi: 10.1016/j.actamat.2008.07.022
  contributor:
    fullname: Yu
– volume: 264
  start-page: 312
  year: 1992
  ident: 10.1016/j.actamat.2015.09.042_bib0130
  article-title: Vacuum-deposited gold films. I. Factors affecting the film morphology
  publication-title: Surf. Sci
  doi: 10.1016/0039-6028(92)90188-C
  contributor:
    fullname: Golan
– volume: 84
  start-page: 185
  year: 1981
  ident: 10.1016/j.actamat.2015.09.042_bib0205
  article-title: Room temperature interdiffusion studies of Au/Sn thin film couples
  publication-title: Thin Solid Films
  doi: 10.1016/0040-6090(81)90468-5
  contributor:
    fullname: Nakahara
– volume: 5
  start-page: 55
  year: 2001
  ident: 10.1016/j.actamat.2015.09.042_bib0030
  article-title: Advances in lead-free electronics soldering
  publication-title: Curr. Opin. Solid State Mater. Sci
  doi: 10.1016/S1359-0286(00)00036-X
  contributor:
    fullname: Suganuma
– volume: 26
  start-page: 29
  year: 1999
  ident: 10.1016/j.actamat.2015.09.042_bib0025
  article-title: Lead-free soldering – where the world is going
  publication-title: Adv. Microelectron
  contributor:
    fullname: Lee
– volume: 37
  start-page: 2375
  year: 1966
  ident: 10.1016/j.actamat.2015.09.042_bib0070
  article-title: Diffusion of gold and silver in tin single crystals
  publication-title: J. Appl. Phys
  doi: 10.1063/1.1708821
  contributor:
    fullname: Dyson
– volume: 96
  start-page: 610
  year: 1954
  ident: 10.1016/j.actamat.2015.09.042_bib0085
  article-title: Diffusion of cadmium, indium, and tin in single crystals of silver
  publication-title: Phys. Rev
  doi: 10.1103/PhysRev.96.610
  contributor:
    fullname: Tomizuka
– start-page: 371
  year: 2010
  ident: 10.1016/j.actamat.2015.09.042_bib0265
  contributor:
    fullname: Mittemeijer
– volume: 14
  start-page: 359
  year: 1983
  ident: 10.1016/j.actamat.2015.09.042_bib0220
  article-title: Surface compositions of copper-silicon alloys
  publication-title: Appl. Surf. Sci
  doi: 10.1016/0378-5963(83)90049-1
  contributor:
    fullname: Frank
– volume: 411
  start-page: 186
  year: 1998
  ident: 10.1016/j.actamat.2015.09.042_bib0215
  article-title: The surface energy of metals
  publication-title: Surf. Sci
  doi: 10.1016/S0039-6028(98)00363-X
  contributor:
    fullname: Vitos
– volume: 56
  start-page: 5818
  year: 2008
  ident: 10.1016/j.actamat.2015.09.042_bib0110
  article-title: Room temperature interfacial reactions in electrodeposited Au/Sn couples
  publication-title: Acta Mater
  doi: 10.1016/j.actamat.2008.08.002
  contributor:
    fullname: Tang
– volume: 77
  start-page: 924
  year: 2003
  ident: 10.1016/j.actamat.2015.09.042_bib0015
  article-title: Characterization of the reaction process in diffusion-soldered Cu/In-48 at.% Sn/Cu joints
  publication-title: Mater. Chem. Phys
  doi: 10.1016/S0254-0584(02)00192-X
  contributor:
    fullname: Sommadossi
– year: 2004
  ident: 10.1016/j.actamat.2015.09.042_bib0180
  contributor:
    fullname: Gottstein
– volume: 8
  start-page: 340
  year: 1987
  ident: 10.1016/j.actamat.2015.09.042_bib0065
  article-title: The Ag-Sn (silver-tin) system
  publication-title: Bull. Alloy Phase Diagr
  doi: 10.1007/BF02869270
  contributor:
    fullname: Karakaya
– volume: 33
  start-page: 948
  year: 2004
  ident: 10.1016/j.actamat.2015.09.042_bib0055
  article-title: Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint
  publication-title: J. Electron. Mater
  doi: 10.1007/s11664-004-0021-1
  contributor:
    fullname: Kim
– volume: 15
  start-page: 189
  year: 1967
  ident: 10.1016/j.actamat.2015.09.042_bib0165
  article-title: Dislocation node determinations of the stacking fault energy in silver-tin alloys
  publication-title: Acta Metal
  doi: 10.1016/0001-6160(67)90191-5
  contributor:
    fullname: Ruff
– year: 2004
  ident: 10.1016/j.actamat.2015.09.042_bib0260
  contributor:
    fullname: Gale
SSID ssj0012740
Score 2.3190458
Snippet Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and...
Intermetallic compound (IMC) formation in thermally-evaporated Ag-Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and...
SourceID proquest
crossref
elsevier
SourceType Aggregation Database
Publisher
StartPage 174
SubjectTerms Formations
Interdiffusion
Intermetallic compounds
Intermetallic compounds (IMCs)
Intermetallics
Kinetics
Silver
Stacking
Thermodynamics
Thin films
Tin
Title Dependence of intermetallic compound formation on the sublayer stacking sequence in Ag–Sn bilayer thin films
URI https://dx.doi.org/10.1016/j.actamat.2015.09.042
https://search.proquest.com/docview/1786200967
Volume 103
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LSwMxEA6lXvQgPrE-SgSv22662c3mWNRSFb2o4C0k2US3tNtit1fxP_gP_SVO9lEfIIKwlw3ZEGay33yTzEwQOgHKwajmEWhAxR4NA-txJgOPJQGPY2sVDV028vVNNLynlw_hQwOd1rkwLqyywv4S0wu0rlq6lTS7szTt3pIg5K4eFVAan_UCl2hOwRjBmu68LMM8CHhdZaZwyD3X-zOLpzuCKecSiKGL8AqLcqe095t9-oHUhfkZbKD1ijfifjm1TdQw2RZa-1JNcBtlZ9WFttrgqcWuEMTzxAC5Hqcau9Bxd4MSXmYrYniA_eH5Qo0lEG8MPFG7jXNch1fDELj_-P76dpthlZad8idotOl4Mt9B94Pzu9OhV12n4OmA9nKPJlwRP1Zg0FmU-EopwGkXFkO41uA2aBLE1PihpMzEPjWcEgt6jACBrNWgvF3UzKaZ2UOYJFJq7sdJ4A5OlZGO5lmiiExYZKhtoU4tRDErq2aIOpxsJCqpCyd14XMBc2ihuBa1-KZ-Acj-16fHtWoE_BruvENmZrqYC8LAXXM-Gtv___AHaBXeil0XEh6iZv68MEfAQ3LVLhZaG630L66GNx8WCN91
link.rule.ids 315,786,790,4521,24144,27957,27958,45620,45714
linkProvider Elsevier
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3JTuQwELVYDgMHxDKjYfdIXEPHHTuOj4hFzXoBJG6W7dgzQU0a0ekr4h_4Q76EqiwMII1GQsrJcSyryim_sl9VEbIDkENyp1LQgM0iLpIQKWmSSOaJyrIQLBcYjXx-kQ6u-cmNuJki-10sDNIqW9vf2PTaWrctvVaavfui6F2yRCjMRwWQJpb9REyTWYTzWL9h9_GN58HA7WpChYWKsPvfMJ7eLcy5MoAMkeIl6nynvP-vDeqTqa73n6NFstACR7rXzG2JTPlymcy_Sye4QsqDtqKt83QUKGaCeLjzgK6HhaPIHccSSvQtXJHCA_CPjid2aAB5UwCKDk_OacevhiHo3u-Xp-fLktqi6VT9gcZQDO_G38n10eHV_iBq6ylELuH9KuK5sizOLOzoMs1jay0YauTFMOUc-A2OJRn3sTBc-izmXnEWQJEpmKAQHGjvB5kpR6X_SSjLjXEqzvIEb06tN4jzArPM5DL1PKyS3U6I-r5Jm6E7PtmtbqWuUeo6VhrmsEqyTtT6g_41mPb_ffqrU42GfwMvPEzpR5OxZhL8NXTS5NrXh98m3wZX52f67PjidJ3MwZv6CIaJDTJTPUz8JoCSym7Vi-4VUzDhBw
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Dependence+of+intermetallic+compound+formation+on+the+sublayer+stacking+sequence+in+Ag%E2%80%93Sn+bilayer+thin+films&rft.jtitle=Acta+materialia&rft.au=Rossi%2C+P.J.&rft.au=Zotov%2C+N.&rft.au=Bischoff%2C+E.&rft.au=Mittemeijer%2C+E.J.&rft.date=2016-01-15&rft.pub=Elsevier+Ltd&rft.issn=1359-6454&rft.eissn=1873-2453&rft.volume=103&rft.spage=174&rft.epage=183&rft_id=info:doi/10.1016%2Fj.actamat.2015.09.042&rft.externalDocID=S1359645415007235
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1359-6454&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1359-6454&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1359-6454&client=summon