Dependence of intermetallic compound formation on the sublayer stacking sequence in Ag–Sn bilayer thin films

Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In...

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Bibliographic Details
Published inActa materialia Vol. 103; pp. 174 - 183
Main Authors Rossi, P.J., Zotov, N., Bischoff, E., Mittemeijer, E.J.
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 15.01.2016
Subjects
Formations
Interdiffusion
Intermetallic compounds
Intermetallic compounds (IMCs)
Intermetallics
Kinetics
Silver
Stacking
Thermodynamics
Thin films
Tin
Thin films
Thermodynamics
Interdiffusion
Intermetallic compounds (IMCs)
Kinetics
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Summary:Intermetallic compound (IMC) formation in thermally-evaporated Ag–Sn bilayer thin films has been investigated employing especially X-ray diffraction (XRD) and (S)TEM methods. The specific IMCs that are present in the as-deposited state depend sensitively on the stacking sequence of the sublayers. In case of Sn on top of Ag, predominantly Ag3Sn is formed, whereas Ag4Sn is predominantly present in the as-deposited state for Ag on top of Sn. In the latter case this is accompanied by an extremely fast uptake of a large amount of Sn by the Ag sublayer, leaving behind macroscopic voids in the Sn sublayer. The results are discussed on the basis of the thermodynamics and kinetics of (IMC) product-layer growth in thin films. It is shown that both thermodynamic and kinetic arguments explain the contrasting phenomena observed. [Display omitted]
Bibliography:ObjectType-Article-1
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ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2015.09.042