Investigation of electrical properties of nanostructured carbon films derived from block copolymers
Electrical properties of nanostructured carbon (ns-C) films fabricated by pyrolysis of PAN–b–PBA copolymers were investigated. Films having cylindrical morphology and pyrolyzed at 400, 500 and 600 °C were investigated. Both carbide forming (Zr, Ti) and non-carbide forming (Cu, Pt) metals spanning a...
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Published in | Synthetic metals Vol. 159; no. 3; pp. 177 - 181 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.02.2009
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | Electrical properties of nanostructured carbon (ns-C) films fabricated by pyrolysis of PAN–b–PBA copolymers were investigated. Films having cylindrical morphology and pyrolyzed at 400, 500 and 600
°C were investigated. Both carbide forming (Zr, Ti) and non-carbide forming (Cu, Pt) metals spanning a wide range of electron work functions (4.1–5.5
eV) formed ohmic contacts to the ns-C films in the as-deposited state. The conductivity of the ns-C films increased roughly three orders of magnitude for every 100
°C increase in the pyrolysis temperature. Hall-effect measurements showed that the films pyrolyzed at 600
°C were n-type with a majority carrier concentration and mobility of 5.8
×
10
18
cm
−3 and 0.97
cm
2/V s, respectively. Current–voltage measurements as a function of temperature (
I–
V–
T) were performed on films pyrolyzed at 600
°C, whereas films pyrolyzed at 400 and 500
°C were too resistive for reliable resistivity–temperature and Hall-effect measurements. The resistivity as a function of temperature was analyzed by using the reduced activation energy method and was determined to follow variable-range hopping (VRH) mechanisms at and below room temperature. The data indicates a crossover from Efros–Shklovskii VRH [J. Phys. C 8, (1975) L49] to Mott VRH [J. Non-Cryst. Solids 1, (1968) 1] at temperatures above 100
K. |
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ISSN: | 0379-6779 1879-3290 |
DOI: | 10.1016/j.synthmet.2008.08.015 |