Nickel–copper hybrid electrodes self-adhered onto a silicon wafer by supersonic cold-spray

• Published in: Acta materialia Vol. 93; pp. 156 - 163
• Main Authors: Lee, Jong-Gun, Kim, Do-Yeon, Kang, Byungjun, Kim, Donghwan, Song, Hee-eun, Kim, Jooyoung, Jung, Woonsuk, Lee, Dukhaeng, Al-Deyab, Salem S., James, Scott C., Yoon, Sam S.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.07.2015
• Subjects: Contact resistivity; Copper; COPPER (PURE); ELECTRICAL CONDUCTIVITY; Electrical resistivity; Electrodes; Nickel; Nickel–copper electrode; Plating; Scanning electron microscopy; Silicon solar cell; Silver; Specific resistivity; SPRAYING; Supersonic cold spraying; Transmission electron microscopy; Silicon solar cell; Specific resistivity; Contact resistivity; Supersonic cold spraying; Nickel–copper electrode
• ISSN: 1359-6454; 1873-2453
• DOI: 10.1016/j.actamat.2015.04.012

[Display omitted] High-performance electrodes are fabricated through supersonic spraying of nickel and copper particles. These electrodes yield low specific resistivities, comparable to electrodes produced by screen-printed silver paste and light-induced plating. The appeal of this fabrication method is the low cost of copper and large area scalability of supersonic spray-coating techniques. The copper and nickel electrode was fabricated in the open air without any pre- or post-treatment. The spray-coated copper–nickel electrode was characterized by optical microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray diffraction, and energy dispersive spectroscopy. Although both SEM and TEM images confirmed voids trapped between flattened particles in the fabricated electrode, this electrode’s resistivity was order 10−6Ωcm, which is comparable to the bulk value for pure copper.