Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

• Published in: Circuit world Vol. 42; no. 1; pp. 32 - 36
• Main Authors: Baszynski, Michal, Ramotowski, Edward, Ostaszewski, Dariusz, Klej, Tomasz, Wojcik, Mariusz, Kohvakka, Mikko, Kamari, Anssi
• Format: Journal Article
• Language: English
• Published: Bradford Emerald Group Publishing Limited 01.02.2016
• Subjects: Adhesives; Aluminum; Boards; Circuit boards; Circuit design; Component reliability; Cooling; Copper; Design; Designers; Dissipation; Electrical & electronic engineering; Electronic components; Electronic devices; Electronics; Engineering; Heat conductivity; Heat transfer; Layouts; Manufacturing; New technology; Printed circuits; Product design; Radiation; Technology; Temperature; Thermal management; Thermal properties; Thermodynamic properties; Heat dissipation; PCB technology; PCB thermal management; PCB
• ISSN: 0305-6120; 1758-602X
• DOI: 10.1108/CW-10-2015-0054

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.