Study of new fluorine-containing epoxy resin for low dielectric constant

• Published in: Surface & coatings technology Vol. 180; pp. 650 - 654
• Main Authors: Lee, J.R., Jin, F.L., Park, S.J., Park, J.M.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.03.2004
• Subjects: Activation energy; Critical stress intensity factor; Cure behavior; Dielectric constant; Epoxy resins; Fluorine; Critical stress intensity factor; Dielectric constant; Cure behavior; Fluorine; Activation energy; Epoxy resins
• ISSN: 0257-8972; 1879-3347
• DOI: 10.1016/j.surfcoat.2003.10.111

In this work, the novel fluorine-containing epoxy resin, 2-diglycidylether of benzotrifluoride (DGEBTF), was prepared and the chemical structure of DGEBTF was confirmed by FT-IR, 13C NMR and 19F NMR spectroscopy. Also, the properties of DGEBTF/diaminodiphenyl methane (DDM) and well-known diglycidylether of bisphenol A (DGEBA)/DDM systems were investigated. As a result, the dielectric constant values of DGEBTF/DDM system were 15% lower than those of DGEBA/DDM system. The critical stress intensity factor and impact strength of DGEBTF/DDM and DGEBA/DDM systems were 5.63 MPa m 1/2, 50 kN/m 2 and 3.53 MPa m 1/2, 26 kN/m 2, respectively. The introduction of trifluoromethyl (CF 3) group into the chain of the epoxy resin resulted in improving the dielectric and mechanical properties and enormously lowered the T g (105 °C) of the studied DGEBTF/DDM. It comes from the internal network change of cured resin.