Electrochemical deposition of cupric ions for the determination of mass transfer rates to a stepped rotating cylinder electrode

• Published in: Transactions of the Institute of Metal Finishing Vol. 81; no. 5; pp. 141 - 147
• Main Authors: Kear, G., Purchase, A., Bremhorst, K.
• Format: Journal Article
• Language: English
• Published: Birmingham Taylor & Francis 2003; Institute of Metal Finishing
• Subjects: Applied sciences; convective-diffusion; copper; Corrosion; Corrosion mechanisms; direct numerical simulation (DNS); disturbed flow; electrodeposition; Exact sciences and technology; flow modelling; Metals. Metallurgy; rotating cylinder electrode (RCE); stepped rotating cylinder electrode (SRCE); Corrosion mechanism; Electrochemical properties; Turbulent flow; Electrochemical corrosion; Rotating electrode; Corrosion test; Electrodeposition; Experimental study; Mass transfer; Cupric ion
• ISSN: 0020-2967; 1745-9192
• DOI: 10.1080/00202967.2003.11871524

The stepped rotating cylinder electrode (SRCE) geometry has been developed as a simple aid to the practical study of the flow-enhanced corrosion and applied electrochemistry problems commonly observed under conditions of disturbed, turbulent flow. The electrodeposition of cupric ions from an acid sulphate plating bath has been used to characterise differential rates of mass transfer to the SRCE. The variation in thickness of electrodeposited copper films has allowed the mapping of local rates of mass transfer over the active surface of this geometry. Both optical and scanning electron microscopy were used for the examination of metallographic sections to provide a high resolution evaluation of the distribution of mass transfer coefficient. Results are also discussed using the convective-diffusion model in combination with the existing direct numerical flow simulation (DNS) data for this geometry.